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  • Qualcomm ICs dominate Amazon's Fire Phone
    Qualcomm ICs dominate Fire Phone
  • Exploring a robust scan insertion methodology
    Exploring scan insertion methodology
  • Advantages of hardware accelerators in processors
    Hardware accelerators' gains in MCUs
  • Self-cooling PVs increase power, life span
    Self-cooling PVs increase power, life span
  • Private cloud bolsters chip design research, education
    Cloud bolsters chip design education
  • Micro Python boards to enter public market
    Micro Python boards to enter public market
  • Cadence delivers FPGA-based rapid prototyping platform
    FPGA-based rapid prototyping platform
  • Designing electric vehicle charger the easy way
    Designing electric vehicle charger easily
  • Guide to DPI development and deployment
    Guide to DPI development & deployment
  • Raspberry Pi B+ adds connectivity, power features
    Raspberry Pi B+ adds power features
  • Nanofibre networks geared for clear, flexible electrodes
    Nanofibre networks for clear electrodes
  • 8Gb DDR3 components tout twofold rise in memory per chip
    DDR3 parts tout twofold rise in memory per chip
Qualcomm ICs dominate Amazon's Fire Phone
Qualcomm ICs dominate Amazon's Fire Phone

Teardown.com's analysis clearly shows Qualcomm as the undisputable winner for IC design and socket wins. Qualcomm's chips also make up the lion's share of the Fire Phone's BOM.

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Exploring a robust scan insertion methodology
Exploring a robust scan insertion methodology

In the modern era, where meeting high performance and low power targets for any complex SoC is quite tough, testing the SoC has become even more challenging.

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Advantages of hardware accelerators in processors
Advantages of hardware accelerators in processors

Developers may achieve compelling performance for their applications while keeping power consumption low through the use of new integrated hardware accelerators.

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Self-cooling PVs increase power, life span
Self-cooling PVs increase power, life span

By adding a specially patterned layer of silica glass to the surface of ordinary solar cells, a team of researchers from Stanford University has found a way to let solar cells cool themselves.

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Private cloud bolsters chip design research, education
Private cloud bolsters chip design research, education

By deploying EDA hardware and software in a private cloud, SRC and SCI hope to grow a whole new crop of qualified SoC design engineers in developing countries worldwide.

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Micro Python boards to enter public market
Micro Python boards to enter public market

The Micro Python board is based on the STM32F405 MCU. It comes ready for Python programming and is one of the fastest on the market, running 168MHz, with 1MiB Flash and 192KiB.

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Cadence delivers FPGA-based rapid prototyping platform
Cadence delivers FPGA-based rapid prototyping platform

The Protium FPGA-based next-generation rapid prototyping platform supports a combination of transaction-level and RTL verification and offers adjustable levels of performance.

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Designing electric vehicle charger the easy way
Designing electric vehicle charger the easy way

The EV and PHEV markets are now looking to include payment and metering options. Learn how a single dual-core embedded processor can easily meet these requirements.

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Guide to DPI development and deployment
Guide to DPI development and deployment

Here are some ideas on how to navigate deep packet inspection solutions in a network functions virtualisation and software defined networking world.

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Raspberry Pi B+ adds connectivity, power features
Raspberry Pi B+ adds connectivity, power features

Featuring a 40-pin extended GPIO, even more sensors, connectors, and expansion boards can be added to the board, allowing users to increase the complexity of their Raspberry Pi projects.

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Nanofibre networks geared for clear, flexible electrodes
Nanofibre networks geared for clear, flexible electrodes

2D aluminium nanofibre networks offering transparent conductors were fabricated by simple wet chemical etching of Al metalised polymer films using an electrospun polystyrene nanofibre mask template.

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8Gb DDR3 components tout twofold rise in memory per chip
8Gb DDR3 components tout twofold rise in memory per chip

The I'M 8Gb components are 100 per cent compatible with the JEDEC standard pinout, timing, and row/column/bank addressing, providing the simplest path to higher density DDR3 upgrades.

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Automotive

Emission standards give fresh impetus for sensing
New concepts in emissions mitigation in the engine and in exhaust aftertreatment systems require advanced sensors for their operation, projected to lead to a shipment of 1.34 billion units in 2019.

Designing electric vehicle charger the easy way
The EV and PHEV markets are now looking to include payment and metering options. Learn how a single dual-core embedded processor can cost-effectively meet these requirements.

Honda recalls 175,000 hybrid vehicles
Considered as the first time in the industry, Honda has conceded that a software glitch in electronic control units could cause cars to accelerate suddenly, resulting in accidents.

VW buys Blackberry R&D lab to take on car infotainment space
Volkswagen Infotainment will dig deeper into the issues and challenges of data exchange between the vehicles and mobile devices such as the car key, music players and smartphones.

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Communications/Network

Startup debuts 60GHz WiFi chip for mobile displays
The NT4600 28nm chip supports 802.11ad with an initial focus on mobile devices, and claims to top Wilocity's forthcoming Sparrow chip by 50-100mW when displaying 4K video.

4G LTE chips geared for indoor small-cell base stations
The BCM617XX 3G and 4G LTE chips from Broadcom claim to deliver data rates up to 300Mb/s, support LTE carrier aggregation and have a digital RF front end.

Samsung powers LTE chip with own Exynos core
The South Korean giant wants to get ahead in the LTE market—mimicking Snapdragon chips and designing others' chips out of its tablets and handsets.

Large data centres speed up adoption of 25GbE
Arista, Broadcom, Google, Microsoft and Mellanox formed the 25G Ethernet Consortium to accelerate development of the speed grades to connect rack-mounted servers to top-of-rack switches.

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Computing/Peripherals

Google, Facebook to go head to head in data centre network
Google and Facebook will share their visions of data centre networking, likely both similar and competing, at the Hot Interconnects event in August.

LTE smartphone SoC supports 2K display
The MT6795 from MediaTek is set to be the first 64bit, LTE, True Octa-core SoC targeting the Android device space, with speed of up to 2.2GHz, to hit the market.

Defining electrons to create quantum computers
A team of researchers demonstrated the scalability of quantum dot architectures by trapping and controlling four electrons in a single device.

Wireless network on a chip poised to cut energy consumption
Washington State University researchers developed a wireless network on a computer chip that they said could cut energy consumption at huge data farms by as much as 20 per cent.

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Consumer Electronics

Startup debuts 60GHz WiFi chip for mobile displays
The NT4600 28nm chip supports 802.11ad with an initial focus on mobile devices, and claims to top Wilocity's forthcoming Sparrow chip by 50-100mW when displaying 4K video.

Anti-glare tech for mobile devices ready for scaling
Researchers roughened a glass surface so it could scatter light and ward off glare but without hurting the glass' transparency, and etched nano-size teeth into the surface to make it anti-reflective.

18in OLED panel can be rolled up to 3cm radius
The transparent panel from LG Display uses polyimide film to achieve the maximum curvature radius, as well as improve flexibility.

Microchip MCUs available in larger flash, RAM options
The PIC32MX1/2 MCUs are intended for designs in digital audio with Bluetooth, USB audio, graphics, touch sensing and general-purpose embedded control.

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IC/Board/Systems Design

Advantages of hardware accelerators in processors
Developers may achieve compelling performance for their applications while keeping power consumption low through the use of new integrated hardware accelerators.

Cadence delivers FPGA-based rapid prototyping platform
The Protium FPGA-based next-generation rapid prototyping platform supports a combination of transaction-level and RTL verification and offers adjustable levels of performance.

Samsung powers LTE chip with own Exynos core
The South Korean giant wants to get ahead in the LTE market—mimicking Snapdragon chips and designing others' chips out of its tablets and handsets.

NI touts all-in-one test device at fraction of cost
NI is hoping to reshape instrumentation with a software-based device that integrates mixed-signal oscilloscope, function generator, digital multi-meter, programmable DC power supply and digital I/O.

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Industrial/Mil/Aero

LED-fitted tag works as UHF RF field detector
Whenever the Photon RFID tag from Farsens comes close to an RF field source, it harvests energy from the RF field and drives its LED according to the field's strength.

Analyst: ASIC market rides high in Asia-Pacific
According to IC Insights, the Asia-Pacific region is seen to boost its share of the ASIC market by 17 per centage points from 2004-2014.

Researchers develop smart sensors with haptic feedback
Fraunhofer ISC's Centre for Smart Materials (CeSMa) created what it describes as a type of smart materials that has potential to be used to create intelligent sensors with haptic feedback.

Inductive sensing of workpieces of any material
This article is one of the runners-up in the TI LDC1000 inductive sensor design contest. It tackles the creation of an inductive switch using LDC1000 to replace mechanical switches in dirty environments.

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Medical

EPC outs A4WP compliant wireless power transfer demo kit
The system is capable of delivering up to 35W into a DC load while operating at 6.78MHz. The kit simplifies the evaluation process of using eGaN FETs for wireless power transfer.

Capacitive touch panel IP geared for HMI devices
Renesas said the IP achieves high-touch sensitivity five times better compared to its R8C/3xT MCUs, as well as high-noise immunity allowing the technology to pass strict noise tests.

Radiation-tolerant memory optimises medical devices
A new type of memory developed by Adesto Technologies has been tested and proven to endure the sterilisation required for medical applications.

Intuitive development kit takes on stepper motor
The TMCM-1043-KIT development system offers designers an easy-to-use PC-based GUI that allows one-click modification of motor drive current, micro-stepping, and other key parameters.

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Power/Smart Energy

Imec, Omron to showcase energy harvesting chip
The collaborators developed a prototype that weighs just 15.4g and harvests vibrations on equipment to provide DC power to sensors in the microwatt range.

Variable HV power supply uses PV optocoupler
This design idea addresses the lack of power supplies with adjustable DC output above 60V. It uses a photovoltaic coupler in a switching regulator.

Drawbacks of state-transition clock gating
Designers must be aware of the pros and cons of clock gating. There are cases where it actually increases the overall dynamic power dissipation, coupled with an area and leakage power overhead.

Wireless network on a chip poised to cut energy consumption
Washington State University researchers developed a wireless network on a computer chip that they said could cut energy consumption at huge data farms by as much as 20 per cent.

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Test & Measurement

Exploring a robust scan insertion methodology
Major design challenges may be tackled upfront during the design phase with a robust scan insertion infrastructure and methodology.

Cadence delivers FPGA-based rapid prototyping platform
The Protium FPGA-based next-generation rapid prototyping platform supports a combination of transaction-level and RTL verification and offers adjustable levels of performance.

Facilitating scope debug of small MCU systems
An output pin of the microcontroller can be utilised for a simple debugging routine for plotting the binary value of one byte on an oscilloscope display.

Test platform aimed at high voltage, high-current devices
Advantest released its PVI8 floating power source that extends the capabilities of its V93000 test platform for high-voltage and high-current testing of embedded power devices.

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Educational Resources
Video Resources
NI VirtualBench All-in-One Instrument
Learn a radically practical approach to benchtop instrumentation – five essential instruments in one device.

Webcasts

SMART PARTS: Additive Manufacturing for Integrated Electro-mechanical DevicesNEW!

3D-printed electronics deliver benefits that mirror those of 3D-printed mechanical parts. Integrate the two processes into one hybrid solution to amplify the advantages in time savings, cost reduction and design flexibility to achieve unmatched efficiencies and create revolutionary products. Join us to discover what is possible when you integrate electro-mechanical design and manufacturing.

Additive Manufacturing 101: Changing the Future of Product Development and Manufacturing
With companies like BMW, GM and Boeing adopting additive manufacturing, the technology has been proven for rapid prototyping in the design-to-production phase. 3D printing helps ensure your designs go to production with a minimal risk of iteration and reach the market faster.

See more

Webcasts

SMART PARTS: Additive Manufacturing for Integrated Electro-mechanical DevicesNEW!

3D-printed electronics deliver benefits that mirror those of 3D-printed mechanical parts. Integrate the two processes into one hybrid solution to amplify the advantages in time savings, cost reduction and design flexibility to achieve unmatched efficiencies and create revolutionary products. Join us to discover what is possible when you integrate electro-mechanical design and manufacturing.

Additive Manufacturing 101: Changing the Future of Product Development and Manufacturing
With companies like BMW, GM and Boeing adopting additive manufacturing, the technology has been proven for rapid prototyping in the design-to-production phase. 3D printing helps ensure your designs go to production with a minimal risk of iteration and reach the market faster.

See more

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video
Tech Impact
Topological insulator to aid in controlling magnetic memory
Bismuth selenide topological insulators enable electrical currents to exert a torque on an adjacent magnetic layer, which could lead to memory technologies that use the least possible energy.

Self-cooling PVs increase power, life span
Laser sensor boosts bomb detection sensitivity



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