TechInsights discuss which wafer bonding technology hints at a possible future for stacked dies.
The ICs provide up to 22W without the use of a heatsink and are packed into a very small SO-8 footprint.
The MCU includes 192kB flash and 20kB RAM, and has enough memory to embed customer applications and host other modulation stacks.
TechInsights discusses which wafer bonding technology hints at a possible future for stacked dies.
The designers use LabVIEW to generate the LTE signal, then the NI vector signal transceiver (VST) to acquire that signal.
The U.S. military sees value in the technology improving mission efficiency through real-time monitoring of combat soldier health status.
High-reliability M-grade converters employ wide-temperature, high-grade components and undergo additional product testing.
It’s been in the making for years, and now it’s hitting the market: the motorised prosthetic LUKE arm.
The AEC-Q200-qualified capacitors feature low impedance down to 18mΩ at 100 kHz for better filtering, and long useful life to 10,000h.
Flexible smartphones | Flexibility will be an option on all components in the future so that devices can be shaped for different purposes. T...
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