EDN Asia - Computers / Boards / Buses

pubDate

Analysis suite features thermal/power co-simulation

Mon, 6 Feb 2012 00:00:00 +0800

Mentor Graphics Corp. has unleashed the version 8.2 of the HyperLynx suite of analysis tools that claims to deliver more features for optimizing PCB designs. These include 3D full-wave field solving and ....

Interconnect solution designed for 10Gbps Ethernet, 16Gbps Fibre Channel applications

Thu, 19 Jan 2012 00:00:00 +0800

The Molex Inc. enhanced zSFP+ (Small Form-factor Pluggable Plus) SMT 20-circuit connectors deliver high-speed performance in telecom and data communications equipment. Designed for 25Gbps serial channels ....

Taimide invests $1.6 million in joint venture with Arakawa Chemical

Tue, 17 Jan 2012 00:00:00 +0800

Taimide Technology, a Taiwan-based polyimide (PI) film supplier has invested $1.6 million in a research joint venture project with Arakawa Chemical Industries, a Japanese company which specializes in ....

Get off the sidelines

Fri, 13 Jan 2012 00:00:00 +0800

Progress: It�s what engineers do. They advance, they grow, and they move forward. To engineers, there is nothing more defeating than standing still or, worse, taking a step back. Yet, for many engineers, ....

Developing markets weather economic pains

Wed, 11 Jan 2012 00:00:00 +0800

In the wake of reports on the unemployment rate, the European Union�s debt management, and the skyrocketing tablet-computer market, however, companies in the electronics supply chain believe that the ....

HSIC compliance test software suited to real-time oscilloscopes

Wed, 11 Jan 2012 00:00:00 +0800

Agilent Technologies Inc. has released a High-Speed Inter-Chip (HSIC) compliance test software for real-time oscilloscopes. The software automatically tests HSIC signals according to HSIC specifications. ....

Automotive driver assistance system optimized for A/V applications

Wed, 11 Jan 2012 00:00:00 +0800

Xilinx, Inc. has unveiled its Field Programmable Gate Array (FPGA) based Ethernet Audio/Video Bridging (EAVB) network system optimized for high-speed data traffic within the automobile. Developed in collaboration ....

Integrated MoCA 2.0 SoC supports higher security levels

Mon, 9 Jan 2012 00:00:00 +0800

Broadcom Corp. has released the MoCA 2.0-Integrated portfolio, which includes six new set-top box (STB) and hybrid IP gateway system-on-chip (SoC) platforms. The MoCA 2.0 includes double video bandwidth, ....

ITRI improves LED light bulb weight

Wed, 4 Jan 2012 00:00:00 +0800

The Industrial Technology Research Institute (ITRI) in Taiwan has announced a technological breakthrough for LED light bulbs. This improvement is expected to decrease the weight of LED light bulbs to ....

Fabricating a high-resolution sensor-to-USB interface

Tue, 3 Jan 2012 00:00:00 +0800

The circuit in this Design Idea combines a mixed-signal microcontroller, a USB UART (universal asynchronous receiver/transmitter), and a novel adaptable analog sensor-input circuit. It allows you to connect ....

EDN Asia - Computers / Boards / Buses

Sponsored Link: TI delivers industry's first Class H VDSL line driver for high-speed networking equipment

Analysis suite features thermal/power co-simulation

Interconnect solution designed for 10Gbps Ethernet, 16Gbps Fibre Channel applications

Taimide invests $1.6 million in joint venture with Arakawa Chemical

Get off the sidelines

Developing markets weather economic pains

HSIC compliance test software suited to real-time oscilloscopes

Automotive driver assistance system optimized for A/V applications

Integrated MoCA 2.0 SoC supports higher security levels

ITRI improves LED light bulb weight

Fabricating a high-resolution sensor-to-USB interface