Quinones show great promise for flow batteries, but finding that same versatility in other organic systems has been challenging.
The TMD2620 and TMD2725 enable aperture size as small as 1.4 and 2.0mm respectively.
The communication module makes it easier to introduce field wireless systems into manufacturing plants.
The ICs provide up to 22W without the use of a heatsink and are packed into a very small SO-8 footprint.
The MCU includes 192kB flash and 20kB RAM, and has enough memory to embed customer applications and host other modulation stacks.
TechInsights discuss which wafer bonding technology hints at a possible future for stacked dies.
TechInsights discusses which wafer bonding technology hints at a possible future for stacked dies.
The designers use LabVIEW to generate the LTE signal, then the NI vector signal transceiver (VST) to acquire that signal.
The U.S. military sees value in the technology improving mission efficiency through real-time monitoring of combat soldier health status.
Flexible smartphones | Flexibility will be an option on all components in the future so that devices can be shaped for different purposes. T...
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