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Applied Materials and A*STAR opens 3D chip R&D lab

01 Mar 2012

Applied Materials Inc. and the Institute of Microelectronics (IME), a research institute under the Agency for Science, Technology and Research (A*STAR) has recently opened the Centre of Excellence in Advanced Packaging at Singapore's Science Park II. The $100 million, world-class facility features a 14,000sqft Class-10 cleanroom and is equipped with a fully-integrated line of 300mm manufacturing systems to support 3D chip packaging R&D.

Conceived to support research collaboration between Applied Materials and IME, the Centre will also allow both parties to pursue independent research initiatives including process engineering, integration and hardware development. For Applied Materials, this is a significant addition of new capabilities in Singapore. The Centre also serves as a demonstration of how A*STAR is able to develop and nurture a local ecosystem for advanced R&D through partnerships with leading corporations. Research activities are already underway with a team of over 50 personnel.

On the collaboration with Applied Materials, Mr. Lim Chuan Poh, Chairman of A*STAR, said, "The combined efforts of Applied Materials and A*STAR's Institute of Microelectronics are a continuing testimony to A*STAR's spectrum of excellent and industry-relevant scientific capabilities. It reaffirms our strategy of leveraging a suite of capabilities to form meaningful public-private research alliances which catalyse the growth of private sector R&D activities in Singapore. This will create many high-value jobs locally and help to further anchor Singapore's semiconductor manufacturing base."



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