Fairchild Semiconductor (FCS) has developed the FDZ661PZ and FDZ663P P-channel, 1.5V specified PowerTrench Thin 0.8x0.8mm WL-CSP MOSFETs. The company claims that the MOSFETs use a state-of-the-art "fine pitch," thin WL-CSP packaging process. With these, the devices are able to minimize board space and R_DS(ON) while achieving excellent thermal characteristics for a miniature form factor.

Key features and benefits of the P-Channel PowerTrench WL-CSP MOSFETs:
 • Very small (0.8x0.8mm) packaging occupies only 0.64mm² of PCB area, less than 16% of the area of a 2x2mm CSP
 • Ultra-low profile is less than 0.4mm height when mounted to PCB
 • Low R_DS(ON) ratings with V_GS as low as -1.5V
 • Excellent thermal characteristics (R_?JA of 93�C/W on 1in² 2oz copper pad)
 • Suitable for use in battery management and load switch functions in mobile applications

Pricing for the RoHS-compliant FDZ661PZ and FDZ663P is at $0.26 per piece for 1,000-quantity orders.