The LGA 1155 and LGA 1156 sockets have several features in common such as a pitch size of 0.9144mm, I/O, power and ground contacts for the mating processors, and a grid array of 40 x 40 with 24 x 16 grid depopulation in the center of the array. Both sockets have contacts arranged in two opposing L-shaped patterns within the grid array for maintenance of electrical contact under processor-load conditions.

Both sockets use high-strength copper alloy as the base contact material to ensure reliable physical contact with their respective LGA land packages, and both sockets are designed to withstand typical reflow conditions, stated the company. There are lead-free solder balls on the underside of both sockets for surface mounting on the motherboard. An Independent Loading Mechanism (ILM)—usable with each of the two sockets and secured to the PCB by means of a base plate—provides the force needed to seat the processor onto the socket and distributes the resulting compressive load evenly through the socket solder joints.

Both LGA1155 and LGA1156-based processors are not compatible between sockets due to electrical, mechanical and keying differences. Their similar three-piece design, comprising socket, ILM and back plate, ensures the easy transfer of useful socket features and advantages from one generation of socket to the next.

Molex's LGA 1155 socket assemblies (47596-0232 and 47596-0233) and LGA 1156 product extensions (47596-0532 and 47596-0533) come in 15µ and 30µ gold-plated contact versions respectively. There is a common alignment-key height of 2.10mm to accommodate an optional ILM pick-and-place cover.

Other new socket components added to the series 47596 family are LGA 1155 and LGA1156 Pan and Shoulder Screws for 1U Servers. These feature 5.60 mm and 4.22 mm thread sizes respectively, and are both lead-free.