SPIL to put in $20.5M in S'pore-based IC substrate maker04 Jul 2012
SPIL evaluated a number of target makers on their technological capabilities and willingness to cooperate with SPIL, and finally selected MCT, SPIL indicated. MCT is willing to cooperate with SPIL to develop IC substrates for packaging high-end logic chips, SPIL noted.
According to industry sources, SPIL's investment in MCT is related to SPIL's development of chip scale package (CSP) for high-density packaging.
SPIL will become the second-largest shareholder of MCT, next to MCT's parent company AEM Holdings whose share will decrease from 100 percent to 57.73 percent.
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