Product Center
ARM Cortex-M3 MCU powers TI's Zigbee SoC solution
22/05/2013
The CC2538 delivers interoperability with existing and future ZigBee products and also supports IP standards-based development IEEE 802.15.4 and 6LoWPAN IPv6 networks.
USB to Ethernet controller supports Microsoft AOAC
21/05/2013
ASIX Electronics' AX88772C offers a small form factor solution and plug-and-play usability, enabling embedded system designers to deliver Ethernet connectivity while leveraging USB 2.0 technology.
Intel, u-blox team up for dedicated HSPA module
20/05/2013
Based on Intel's XMM 6255 HSPA modem platform, the chipset will be packaged in a compact, low-cost module that maintains layout compatibility with u-blox' SARA 2G and LISA 3G module series.
Samsung unveils 45nm eFlash logic process dev't
20/05/2013
The 45nm eFlash logic may be adopted into smart card ICs, NFC ICs, embedded secure elements and trusted platform modules.
VDSL chipset touts 200Mb/s bonding, up to 150Mb/s vectoring
17/05/2013
The XWAY VRX300 from Lantiq enables support for ITU-T standard frequency band plans (Profile 8, 12, 17 and 30MHz) aimed at in-home networking.
Molex extends Brad Nano-Change connectors to M8 standard
17/05/2013
The rugged Nano-Change product line now conforms to the smaller M8 form factor standards while offering a broad selection of connectors and receptacles for sensor and actuator applications.
Ericsson's digital converters deliver high co-planarity
16/05/2013
Ericsson's surface-mount BMR456-SI and the through-hole BMR456-PI quarter-brick 3E* Advanced Bus Converters boast fast response times, tightly regulated intermediate bus voltages and high efficiency.
GL Communications rolls out LTE x2 Interface emulator
15/05/2013
The X2-AP test tool boasts utilities like a message editor, script editor, and profile editor, allowing new scenarios to be created or existing scenarios to be modified using messages and parameters.
IoT start-up launches development environment
14/05/2013
Thingsquare Code by Internet of Things company Thingsquare connects household electronics to smartphones.
MoSys outs Bandwidth Engine 2 – Burst IC samples
10/05/2013
The MSR620 offers the highest data throughput for high-speed 100G to 400G packet buffer applications.
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