Design Center
FPGAs, multi-core CPUs alter embedded design scene
24/04/2013
Here's an overview of how the combination of FPGAs, multi-core CPUs and graphical programming environments are changing the nature of embedded systems design.
SoCs combine MPU flexibility, FPGA performance
22/04/2013
Embedded-system architectures built on a combination of MCUs and FPGAs offer the kind of adaptability increasingly needed to support changing demand for greater functionality across diverse applications.
Overcome the embedded CPU performance hurdle
12/04/2013
Learn about the silicon limitations and how they affect CPU performance, and discover how engineers are overcoming this situation with multi-core design.
Enable sharing with PCI Express
03/04/2013
PCIe Gen3 is capable of supporting shared I/O and clustering, providing system designers with a tool to make their designs optimally efficient.
Ease embedded design with cloud-enabled platforms
28/03/2013
Designers developing tomorrow's advanced embedded systems will rely on a new generation of integrated development platforms that seamlessly integrate local and web-based resources.
Examining the advances in audio amplifiers
25/03/2013
Here's a look at the architecture and circuit techniques used in a new generation of audio amplifiers.
How to characterise mixed-signal IC for production
06/03/2013
Know the statistical techniques that ensure repeatability of test results, including testing over an ICs rated temperature extremes.
Accelerating pre-silicon validation
20/02/2013
Here's a look at the advantages and constraints of some debugging techniques for FPGAs.
Power management using a single-chip solution
19/02/2013
From the deepest sub nanometre processors to the analogue I/O, it's easy to see the need for power management devices for 1.0V, 1.2V, 1.5V, 1.8V, 2.2V, 2.5V, 2.8V, 3.0V, 3.3V and more, all in the same box.
I got a screen... What's next?
12/02/2013
Most companies begin new projects by determining the hardware, and then flounder when squeezing in features. This real-life ending may be avoided if they took a few pages out of a fairy-tale ending.
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Product Center
Software-based SR tech for low energy mobile apps
24/05/2013
CEVA's Super-Resolution algorithm is fully optimised to run in real-time using minimal processing workload and very low memory bandwidth on the CEVA-MM3101 imaging and vision platform.
TDK chip bead series fits into 0603 case
24/05/2013
The MMZ0603-E series fits into a case size 0603 (EIA 0201), which is 80% smaller than the MMZ1005-E types.
Cypress' IDE promises to speed, ease embedded design
23/05/2013
The PSoC Designer 5.4 includes more than 40 enhanced User Modules, which are free "Virtual Chips," that are used to integrate multiple ICs and system interfaces into a single PSoC device.
Downloadable JTAG suite boasts speedy board failure test
23/05/2013
The JTAGLive Studio is a comprehensive package of Python-based JTAG boundary-scan tools that enable electronic designers and test engineers to develop complete PCB test and programming applications.
Tempus solution by Cadence boasts quicker closure
23/05/2013
The Tempus Timing Signoff Solution combines support for massively parallel computation with a new path-based analysis approach and physically-aware closure.
Mentor to integrate Calibre 3DSTACK into Tezzaron's 3D-IC
22/05/2013
The integration will focus on fast verification of die-to-die interactions in 2.5D and 3D ICs, while verifying die-to-die interfaces in a separate procedure with specialised automation features.
Samsung unveils 45nm eFlash logic process dev't
20/05/2013
The 45nm eFlash logic may be adopted into smart card ICs, NFC ICs, embedded secure elements and trusted platform modules.
Raspberry Pi gets a camera board
20/05/2013
Element14's Raspberry Pi camera board features 5 megapixel native resolution sensor and supports 1080p30, 720p60 and 640x480p60/90 video.
ARM works with LogMeIn to accelerate IoT
16/05/2013
LogMeIn's Xively Jumpstart Kit is a rapid prototyping-to-production bundle that significantly reduces the cost and complexity of bringing IoT products and solutions to market.
GL Communications rolls out LTE x2 Interface emulator
15/05/2013
The X2-AP test tool boasts utilities like a message editor, script editor, and profile editor, allowing new scenarios to be created or existing scenarios to be modified using messages and parameters.
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News Center
Graphene-based ink makes foldable electronics a reality
24/05/2013
Researchers from Northwestern University have developed a graphene-based ink that claims to be highly conductive and tolerant to bending.
Globalfoundries, imec join forces in STT-MRAM R&D
23/05/2013
Imec and Globalfoundries will work together with other fabless and equipment suppliers to collaborate on exploring the potential of STT-MRAM technology.
Graphene stacking and the future of electronics
21/05/2013
The experiment conducted by MIT researchers may allow the use of graphene as a switch in transistor applications, providing a viable and inexpensive alternative to silicon electronics.
CSIRO machine prints Australia's largest solar cell
17/05/2013
The printer has allowed researchers to print organic photovoltaic cells the size of an A3 sheet of paper using known techniques.
Altera buys power tech provider Enpirion
16/05/2013
The addition of Enpirion's power technologies will enhance Altera's FPGA roadmap and product offerings.
Nano-chemical sensor sensitivity fine-tuning technique discovered
13/05/2013
The finding will open up entirely new possibilities for modulation and control of the chemical sensitivity of these sensors, without compromising the intrinsic electrical and structural properties of graphene.
Carbon nanotube transistor reaches 25GHz
09/05/2013
The transistor created by USC engineers beats the 15GHz record performance of previously created carbon nanotube transistors, making it the fastest so far.
Mouser, ADI ink global distribution deal
08/05/2013
The agreement covers Analog Devices' complete product portfolio including data converters, amplifiers, MEMS, DSPs, RF and power management ICs and associated development tools.
Study aids in making PSC commercialisation a reality
08/05/2013
UNIST researchers have developed high-performance polymer solar cell (PSC) with power conversion efficiency (PCE) of 8.92 per cent, the highest values reported to date for plasmonic PSCs using metal nanoparticles.
MEMS group releases parameter specs
07/05/2013
MEMS Industry Group's Sensor Performance Parameter Definitions identifies the performance parameter specifications of accelerometers, magnetometers, gyroscopes, pressure sensors and other sensors.
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