NI's PXIe power supplies deliver high power density
The PXIe-4112 and PXIe-4113 programmable power supplies provide two 60-W power-supply channels from a single PXI Express slot and can be combined to deliver a single 120W channel.
Mentor to integrate Calibre 3DSTACK into Tezzaron's 3D-IC
The integration will focus on fast verification of die-to-die interactions in 2.5D and 3D ICs, while verifying die-to-die interfaces in a separate procedure with specialised automation features.
AVX's ultra-low profile connectors last for 5000 cycles
The 9155-100 series of compression connectors have minimum operating height of 1.3mm and a mechanical endurance rating of 5000 mating cycles.
800-1600Mbit/s data rate supported by memory module sockets
Molex's DDR3 DIMM sockets supports data rates of 800 to 1600Mbit/s with clock frequencies of 400 to 800MHz, double than that of the DDR2 interface.
Geotest-Marvin extends PXI chassis portfolio
The GX7200 requires one slot for the controller, offering 20-slots for PXI-1, PXI-hybrid and PXIe modules while the GX7800 is an 8-slot, 3U PXI chassis that can support up to seven instruments.
AST rolls out explosion-proof pressure transducer
Aimed at oil and gas well site applications, the AST46DS transducer comes with zero function capability and voltage or 4-20mA output signals.
Vishay resistors aimed at car, industrial apps
The thin film chip resistors, ACAS 0606 AT and ACAS 0612 AT, tout tighter absolute tolerance, relative tolerance, and relative TCR for the latest S, T and U accuracy grades.
Ic-Haus rolls out 3.3V digital sensor output driver
Ic-Haus' latest digital output driver enables compact sensors to be equipped with NPN, PNP, push-pull, and IO link-compatible output driver options.
System chassis eases dev't, testing, deployment
The Emerson Network Power VPX KR8-VPX-3-6-1 system chassis accommodates up to five 3U VPX payload blades and associated rear transition modules.
GaN in Plastic transistors target radar systems
M/A-COM transistors can scale to peak pulse power levels of 100W and ideal for high-performance radar systems.
Imec, Renesas team up eye next-gen wireless solutions
The collaboration aims to develop best-in-class performance and reduce power consumption of devices leveraging the companies' strengths in developing wireless solutions.
MIG announces MEMS Sensor Fusion symposium
MIG speakers will discuss how sensor fusion, the combination of data from several sensors for the purpose of improving application performance, is moving rapidly into the commercialisation phase.
Novel tilt sensor employs echolocation technique
The technique is seen to extend the capabilities of devices that already use ultrasonic components, whether for locating defects in materials, visualizing anatomical structures or determining range.
High voltage foundry options for touch sensing apps
MagnaChip Semiconductor broadened its line-up of high voltage options for its 0.18um embedded EEPROM process technology aimed at smartphones, tablets, notebooks and smart TVs.
Mouser, ADI ink global distribution deal
The agreement covers Analog Devices' complete product portfolio including data converters, amplifiers, MEMS, DSPs, RF and power management ICs and associated development tools.
3-D print your way to invisibility
Duke University's invisibility cloak looks oddly like a Frisbee made out of Swiss cheese and deflects microwave beams.
Fraunhofer develops mini-OLED display production method
A new kind of production developed by Fraunhofer researchers not only saves costs, but also improves the radiance of the OLED.
NI, FIRST further student interests via robotics platform
The technology partnership centres around the creation of a next-generation embedded robotics control platform code-named "Athena."
Infineon, Globalfoundries team up for eFlash process tech
The cooperation will focus on technology development based on Infineon's eFlash cell design and manufacturing of automotive and security MCUs with 40nm process structures.
"Taxels" translate movements into electronic signals
The devices developed by the Georgia Tech researchers rely on a different physical phenomenon—tiny polarization charges formed when piezoelectric materials such as zinc oxide are moved or placed under strain.