RFaxis debuts 802.11ac WLAN RF front-end ICs 20/06/2013
The RFX8050x and RFX8051x series of RF front-end ICs are manufactured in a bulk CMOS process and provides complete functionality for 5GHz 802.11ac operation.

Molex's modular backplane ready for heavy RF load 20/06/2013
The RF DIN 1.0/2.3 modular backplane system from Molex enables users to transfer multiple RF signals across mated boards in a single assembly and uses DIN 1.0/2.3 connectors for dense packing.

Fluke Networks updates data-com installation tools 19/06/2013
The new family of Versiv cable certification testers features interchangeable modules for copper, fibre and optical time domain reflectometer testing.

RF DIN 1.0/2.3 connector system allows board-to-board mating 19/06/2013
Molex's modular board-to-board system offers multiple options including a standard four port, 75&Omega contact version or customisable six, eight and 10 ports with 50Ω contacts.

Solid-state drives combine 20nm NAND with 6bit/s SATA 18/06/2013
The DC S3500 series of SSDs combine 20nm NAND flash memory technology with a SATA 6Gbit/s interface, delivering sequential read speeds of up to 500MB/s and sequential write speeds of up to 450MB/s.

R&S FSW analyser expands its range to 320MHz 18/06/2013
With the extension, Rohde & Schwarz FSW analyser can now be used in a variety of applications related to wideband digital communications and radar systems.

Tektronix unveils tool for LTE, fixed IP testing 18/06/2013
Tektronix's Spectra2 XL3 performs diameter, VoIP/TDM and media testing and hosts the Spectra2 IMS and EPC test application.

Diode's integrated regulator transistors tolerate up to 100V 17/06/2013
ZXTR200x family of high-voltage regulators boosts power-circuit densities through reductions in component count and footprint.

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Cavium's OCTEON III processors feature MIPSr5 design 19/06/2013
The MIPS64 architecture will power Cavium's OCTEON III family of 1 – 48 core processors that deliver over 100Gbit/s of application performance per chip.

1.2kV IGBTs aimed at motor drive, UPS systems 18/06/2013
The devices leverage IR's field stop trench ultra-thin wafer technology that claims to deliver lower conduction and switching losses.

Samsung unveils PCI-e SSD for ultra-slim notebooks 18/06/2013
Samsung XP941 enables a sequential read performance of 1,400MB/s, which is the highest performance available with a PCIe 2.0 interface.

Solid-state drives combine 20nm NAND with 6bit/s SATA 18/06/2013
The DC S3500 series of SSDs combine 20nm NAND flash memory technology with a SATA 6Gbit/s interface, delivering sequential read speeds of up to 500MB/s and sequential write speeds of up to 450MB/s.

PCI Express digitizers boast 500Msamples/s sampling rate 18/06/2013
Spectrum's M4i.445x-x8 digitizers provides a signal bandwidth of 250MHz, two or four input channels, and 4GB of onboard memory as standard.

Toshiba claims world's first multi-level-cell structure MROM 17/06/2013
Toshiba achieved this breakthrough by adopting a multi-level-cell structure, which also secures high speed operation.

CMOS-compatible transistor for RF/analogue apps 14/06/2013
Toshiba's novel device structure uses two different materials as the gate electrode of a single MOSFET and a process integration scheme that employs a common semiconductor manufacturing method.

Intel's 4^th gen processors bolster graphics, security 13/06/2013
Compared to Intel's third-generation processors, the new devices feature up to 15 per cent faster processor performance and nearly 25 per cent faster graphics performance.

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Ultra-sensitive QTC Ultra Sensor avoids light loss 20/06/2013
Peratech's QTC Ultra Sensor is so sensitive that it can be placed behind the OLED display and still detects finger touches on the front of the display.

Molex's modular backplane ready for heavy RF load 20/06/2013
The RF DIN 1.0/2.3 modular backplane system from Molex enables users to transfer multiple RF signals across mated boards in a single assembly and uses DIN 1.0/2.3 connectors for dense packing.

PIC32MX 32bit MCUs boast high RAM memory options 18/06/2013
Microchip Technology's new line of PIC32MX3/4 MCUs feature28 x 10bit ADCs and 5 UARTS, 105 DMIPS performance, serial peripherals, graphic-display, capacitive-touch, and connectivity.

Quad-core HSPA+ processor aimed at smartphones 17/06/2013
The BCM23550 from Broadcom features 1.2GHz A7 CPU with ARM NEON technology and is optimised for the Android 4.2 Jelly Bean OS.

Two-axis magnetic sensor geared for portable apps 13/06/2013
The MMC246xMT from MEMSIC claims to offer the industry's best performance at the lowest power consumption for a two-axis magnetic sensor, making it ideal for portable applications.

NXP uncloaks dimmable single-stage LED controller 13/06/2013
The SSL3401 is compatible with various dimmers and transformers, and generates a stable and accurate current while dimming down to below 5% of maximum light output.

Rectifiers increase power density, reduce switching loss 11/06/2013
Vishay Intertechnology's FRED Pt rectifiers are built with a planar, platinum-doped process.

Chip-scale Schottky promises twice the power density 11/06/2013
The SDM0230CSP from Diodes offers smartphone and tablet designs with an alternative to miniature DFN0603-packaged devices, boasting twice the power density in the same PCB footprint.

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Atollic TrueSTUDIO promises high-quality embedded design 19/06/2013
The IDE touts the ability to record/display instruction trace data, and features an automatic software unit testing and test case debugger within the optional TrueVERIFIER and TrueANALYZER modules.

Cryptographic sol'n for medical sensors, industrial apps 19/06/2013
The DS28E35 DeepCover Secure Authenticator from Maxim incorporates a FIPS 186-based, ECDSA engine to implement asymmetric (public-key) cryptography.

Spin coatable negative photoresist eyes MEMS, IC wafers 18/06/2013
Engineered Material Systems' NR-2500 photoresist formulation has been optimised for processing and spin coating on MEMS and IC wafers.

Fairchild eases BLDC motor controller reference design 17/06/2013
Reference design RD-401 uses SPM smart power modules and incorporates PFC to enable designers to simplify design, reduce BOM costs and develop rapid prototypes.

Design kit aimed at all SoC processor cores 14/06/2013
Synopsys' DesignWare HPC Design Kit contains a suite of high-speed and high-density memory instances and standard cell libraries that allow SoC designers to optimise on-chip CPU, GPU and DSP IP cores.

Altera outs Generation 10 FPGAs and SoCs 13/06/2013
The Stratix 10 and Arria 10 FPGAs and SoCs leverage Intel's 14nm Tri-Gate process and TSMC's 20nm process, respectively.

IXYS unveils high power RF drivers 12/06/2013
The IXRFD630 and IXRFD631 are CMOS high-speed gate drivers aimed to drive MOSFETs in Class D and E HF RF applications as well as other applications requiring ultrafast rise and fall times.

FEI's DualBeam analysis system delivers faster results 11/06/2013
Helios NanoLab 1200AT can create site-specific TEM samples thin enough to capture a single transistor at the 10nm node, from wafers up to 300mm in diameter.

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1500VDC photovoltaic fuses for solar installations 20/06/2013
Littelfuse's SPXV and SPXN series of fuses meet tough requirements of 30kA interrupt ratings, 1500VDC protection and global standards critical to solar equipment manufacturers.

Incremental Rotary encoders for space starved apps 20/06/2013
The output of the 7S series encoders is open collector with a maximum current consumption of 30mA.

XP Power debuts surge protection module for military apps 20/06/2013
The DSF226 filter is ideal for use in combination with XP Power's MTC family of military-specification DC/DC converters, QSB and ICH series of power bricks.

1.2kV IGBTs aimed at motor drive, UPS systems 18/06/2013
The devices leverage IR's field stop trench ultra-thin wafer technology that claims to deliver lower conduction and switching losses.

Ideal diode bridge controller reduces power dissipation 17/06/2013
Linear's LT4320 ideal diode bridge controller replaces each of the four diodes in a full-wave bridge rectifier with a low loss N-channel MOSFET and operates from DC to 600Hz.

TDK debuts 250W convection cooled power supply 17/06/2013
TDK's CUS250LD serieslow profile AC-DC power supplies are convection cooled passing the need for fans while also reducing acoustic noise and vibrations.

SiC power module from Cree boasts 1.2kV, 50A 14/06/2013
The CCS050M12CM2 is a 1.2kV, 50A SiC six-pack power module in a 45mm package, offering reductions in power losses and corresponding heat sink size requirements.

RFMD's 500W GaN L-Band amp supports 1.2-1.4GHz 13/06/2013
The RFHA1027 is housed in a small form factor package of 24 x 17.4mm, and is input and output matched to 50Ω, promising a significant decrease in external components.

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PIC32MX 32bit MCUs boast high RAM memory options 18/06/2013
Microchip Technology's new line of PIC32MX3/4 MCUs feature28 x 10bit ADCs and 5 UARTS, 105 DMIPS performance, serial peripherals, graphic-display, capacitive-touch, and connectivity.

Fully-organic imager targets x-ray apps 14/06/2013
The imager is sensitive in the wavelength range between 500nm and 600nm, which ideal for x-ray imaging.

SemiLEDs expands vertical UV-LED portfolio 13/06/2013
The 10W high-power N9 series and the 0.17-0.50W mid-power P50N series take advantage of SemiLEDs' patented vertical LED structure that touts superior performance in directional industrial applications.

OD capillary tubing ready for chromatography apps 03/06/2013
Polymicro's 1/32-inch OD capillary tubing is drawn from high purity synthetic silica and externally coated with polyimide, an abrasion-resistant protective polymer.

Element14 adds RECOM Power's portfolio 21/05/2013
Products in RECOM Power's portfolio are compliant with the new RoHS2 directive and are touted to deliver high efficiency.

LED dimming features in LED power supply 16/05/2013
Bear Power Supplies' DC/DC converter for handheld LED devices features a microprocessor for programming LED dimming and is designed for high-performance applications.

Non-magnetic inductor touted as world's smallest 10/05/2013
The SMG1812 from Gowanda Electronics is geared for medical imaging and other magnetic-sensitive applications such as test devices and medical diagnostic equipment.

MCU boasts ARM Cortex-M4 32bit/DSP core 06/05/2013
The STM32F401 from ST claims to balance performance, power consumption and integration by offering 105DMIPS at 84MHz, 187µA/MHz active current and 11µA typical STOP current.

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1500VDC photovoltaic fuses for solar installations 20/06/2013
Littelfuse's SPXV and SPXN series of fuses meet tough requirements of 30kA interrupt ratings, 1500VDC protection and global standards critical to solar equipment manufacturers.

XP Power debuts surge protection module for military apps 20/06/2013
The DSF226 filter is ideal for use in combination with XP Power's MTC family of military-specification DC/DC converters, QSB and ICH series of power bricks.

VPG rolls out Z-Foil power current sensing resistor line 19/06/2013
The VCS331Z, VCS332Z, VFP4Z, and CSNG Series feature low TCR of ±0.2 ppm/°C from -55°C to 125°C, 25°C ref., PCR (ΔR due to self-heating) of 4ppm/W typical, and tolerances to ±0.01 per cent.

Power monitor module integrates in-circuit emulator 18/06/2013
Microchip's AC244008 power monitor module combines MPLAB REAL ICE and MPLAB X IDE enables designers in identifying and eliminating code that consumes high current in real time.

TDK debuts 250W convection cooled power supply 17/06/2013
TDK's CUS250LD serieslow profile AC-DC power supplies are convection cooled passing the need for fans while also reducing acoustic noise and vibrations.

SiC power module from Cree boasts 1.2kV, 50A 14/06/2013
The CCS050M12CM2 is a 1.2kV, 50A SiC six-pack power module in a 45mm package, offering reductions in power losses and corresponding heat sink size requirements.

TI's 12bit ADCs that handle speeds up to 900 Msamples/s 12/06/2013
The ADS5409 family of 12bit ADCs offer sampling speeds ranging from 500Msamples/s to 900Msamples/s and come in 12×12mm BGA packages.

Analdigics' RF amplifier boasts 1.4W of power 11/06/2013
The ASC7517 RF power amplifier is optimised for 3G and 4G small-cell base stations and operates over a frequency band of 2100MHz to 2170MHz.

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NI's Chameleon software eases data logging for test apps 19/06/2013
The Chameleon for NI CompactDAQ provides engineers with data acquisition and logging systems to log static and dynamic signals from microphone arrays and other sensors without any programming.

R&S FSW analyser expands its range to 320MHz 18/06/2013
With the extension, Rohde & Schwarz FSW analyser can now be used in a variety of applications related to wideband digital communications and radar systems.

Tektronix unveils tool for LTE, fixed IP testing 18/06/2013
Tektronix's Spectra2 XL3 performs diameter, VoIP/TDM and media testing and hosts the Spectra2 IMS and EPC test application.

Keyence unveils single click 3D macroscope 17/06/2013
The VR-3000 automatically scans and collects 3D data without the need to set or adjust individual parameters and calculates profiles, roughness, waviness, height changes, angles, and volumes.

MACOM rolls out 30dB gain range amplifier 11/06/2013
MACOM Techonology Solutions MAAM-011100 broadband variable-gain amplifier operates from 500MHz to 20GHz and provides flat gain control from 10dB to –20dB.

R&S' vector network analysers add midrange line up 11/06/2013
The ZNB20 and ZNB40 analysers are designed for frequency ranges of 100kHz to 20GHz and 10MHz to 40GHz and are equipped with two test ports and a 16:9 format touch screen for easy operation.

Goepel releases modular test unit for LVDS, HDMI in cars 11/06/2013
The Video Dragon modular test unit is able to record and analyse single images and video sequences in raw data format or as compressed files at a frame rate of up to 60 images per second.

R&S FSW analyser adds real-time signal analysis option 06/06/2013
Rohde & Schwarz's new option for its FSW high-end signal and spectrum analyser enables real-time signal analysis for frequencies of up to 50GHz with an analysis bandwidth of 160MHz.

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