Rudolph Technologies—in high-performance process control metrology, defect inspection and data analysis for the semiconductor manufacturing industry—announced the sale of both front and backend inspection systems to austriamicrosystems, designer and manufacturer of high performance analog integrated circuits (ICs) for communication, industrial, medical and automotive applications.
austriamicrosystems has purchased one AXi Series tool, a cleanroom compatible, high-resolution macro defect inspection system for front-end processes, and one NSX Series tool, which is designed to handle macro defect inspection of wafers and thin wafers on film frames in back-end processes. austriamicrosystems will use the new Rudolph inspection tools for internal process control and yield enhancement, as well as to meet the zero defect requirements of its automotive customers for outgoing inspection.
Johan Oosterlee, vice president for purchasing at austriamicrosystems, said, “Rudolph could demonstrate the capability to address the full range of inspection requirements throughout our manufacturing process. The AXi System has the resolution and Class 1 cleanroom compatibility we need for our front end processes. The ability to share data between systems can enhance our ability to look for relationships between front-end and back end defectivity mechanisms.”
Nathan Little, executive vice president and general manager of Rudolph's inspection business unit, stated, “The automotive industry is one of the leading industrial sectors requiring outgoing quality control with 100 percent inspection requirements. We currently supply inspection capability to every major automotive chip provider, and we are gratified to see our technology emerging as the de facto industry standard.”
Rudolph Technologiesaustriamicrosystems
