Broadcom Corporation has announced a solution for mobile handsets that integrates a High-Speed Downlink Packet Access (HSDPA) baseband modem with world-class application, audio and multimedia processors on a single monolithic chip. The mixed-signal device is a 65 nanometer CMOS process and integrates a Category 8 HSDPA modem that delivers 7.2 Mbps (megabits per second) third generation (3G) connectivity for advanced applications. With this level of integration, the HSDPA processor requires less board space, cost and power than competing solutions, thus eliminating the cost premium associated with HSDPA handsets.
Built on 65 nm CMOS process, the BCM2153 integrates 7.2 Mbps, Category 8 HSDPA baseband modem with application, audio, and multimedia processors on one chip. Mixed-signal device also features M-Stream signal enhancement technology, multiple connectivity options, and 480 Mbps USB 2.0 port with integrated PHY. Suited for mobile handsets, this HEDGE (HSDPA + EDGE) multimedia baseband processor provides complete support for all legacy GSM cellular technologies.
