Ansoft Corporation, developer of electronic design automation (EDA) software and Samsung (Samsung Electro-Mechanics Co Ltd), announced the release of a new model library of Samsung’s miniaturized surface-mount Multilayer Ceramic Chip Capacitors (MLCC). These MLCCs are used for decoupling and temperature compensation in applications where PC board space is limited. The new MLCC library allows engineers using Nexxim and Ansoft Designer to simulate advanced PCB and hybrid IC designs.
The new library contains over 400 capacitor models ranging in capacitance values from .5 pf to 47 uf for use with operating voltages up to 50 V depending on chip size. Each component model utilizes S-parameter data from actual device characterization to provide accuracy of the capacitor’s electrical response within a Nexxim simulation. Nexxim is able to use the frequency-domain models provided by the S-parameters in both frequency- and time-domain analyses.
Kangheon Hur, vice president of Samsung, said, “The rapid advancement of mobile communications and small electronics products is driving demand for parts with ever-higher precision. We are pleased to team with Ansoft to address customer needs for accurate simulation and manufacturing data so that these components can be readily incorporated into the next generation of products.”
Samsung
