Teradyne Inc. exhibited for the seventh consecutive year at SEMICON China. Teradyne showed the J750Ex, the new 200 MHz test configuration from acclaimed J750 test system family. The company highlighted Teradyne’s UltraFLEX Test System for efficiency multisite test of today’s high performance devices.
The UltraFLEX test system is designed for today's complex mixed-signal, system-on-a-chip (SoC), and system-in-package (SiP) devices. With over 2200 digital pins at Gigahertz speeds and a full suite of analog instrumentation, UltraFLEX can test a range of device technologies, including digital, analog, DC, RF and memory, while delivering nearly good test efficiency even in parallel test environments for optimum throughput and cost of test.
SI Wei, vice president, semiconductor test field operations, Greater China Region, Teradyne, said, "Teradyne continues to show its commitment to the growing China market. This is the seventh consecutive year we have exhibited at SEMICON China, and are very excited to unveil our newest test system, the J750Ex at the show. We look to continue providing our customers with the newest technology and best test solutions to help enhance their success."
Temasek Holdings
