Infineon Technologies announced a new ADSL2+ system-on-a-chip (SoC) for customer premise equipment (CPE) that will help drive broadband penetration in emerging markets. Amazon-SE, the third generation of the field-proven Infineon ADSL/2/2+ CPE chip solutions, targets bridge-modem and USB (Universal Serial Bus) modem applications.
Offered in a PG-LQFP-144 (144-pin plastic green low profile quad flat package) package, the Amazon-SE allows for a two-layer PCB (printed circuit board) design, compared with the four layers required by existing solutions. In USB modem applications, the Amazon-SE achieves further optimizations by eliminating the need for an external power supply and removing the Flash memory component altogether, because the modem is powered and booted from the user’s PC.
Amazon-SE features integrated SD/MMC (Secure Digital/MultiMedia Card) and SPI (Serial Peripheral Interface) interfaces, as well as programmable Packet Processor Engine (PPE) to also enable the design of WiFi ADSL2+ gateways with boosted routing performance allowing system integrators to offer an even broader range of ADSL2+ solutions based on a single hardware / software architecture.
According to research firm iSuppli, shipments of ADSL modems and ADSL/WLAN gateways to Asia, China and Latin America will exceed 41 million units by 2008, compared with 28.5 million units shipped in 2006.
Fully supporting all ADSL2+ standards including ITU-T G.992.1/3/5 (ADSL/2/2+) annexes A, B, I, J, M, and L, ITU-T G.992.2 (G.lite) annex A and ANSI T1.413 Issue 2, Amazon -SE provides line-rate throughput up to 30 Mbit/s (downstream) for all packet sizes in Bridge-modem applications.
Christian Wolff, senior vice president of communication solutions business group and general manager of wireline access business unit at Infineon, said, "With the Amazon-SE, Infineon provides its customers with an optimized solution to successfully address the high growth emerging broadband markets. The Amazon-SE is the newest member of our extensive CPE products family that enables system providers to serve multiple applications and markets using the same hardware/software platform."
Infineon Technology
