At Nepcon China 2007 (24-27 April 2007), SolderStar will be launching Neptune SL USB, a new miniature datalogger that will enhance the performance and capabilities of the SolderStar profiling range, including SolderStar PRO and WaveShuttle. Measuring just 100mm x 50mm x 9mm, the smallest in the industry, the new Neptune SL USB is designed to offer a flexible solution to reflow, wave and continuous profiling through its unique Smartlink connection system.
The new datalogger is the first direct USB connect system in the industry. High speed USB eases installation on modern PC's, reduces data download times and also provides power to recharge the internal high temperature battery, all from one simple connection lead.
As part of a pass-through reflow profiling system, the datalogger attaches by way of its Smartlink system to a range of Temperature Channel Adapters (TCA's) which provide between 6 and 16 measurement channels in a variety of configurations. The TCAs and Smartlink system effectively future-proof the system by allowing the channel count to be upgraded in line with the growing complexity of current and future assemblies.
Also being launched at Nepcon China 2007 will be an advanced profiling system, the new SolderStar APS (Automatic Profiling System) which uses new features built into the latest evolutions of reflow data loggers to provide both pass-through profiling functions and full-time process monitoring solutions, capable of providing a profile for every board, in a single hardware platform.
The heart of the new APS system is SolderStar's innovative SmartLink connection system and a new miniature SolderStar PRO - 16 channel USB datalogger, called Neptume SL USB, also debuting at the show. This latest development of datalogger adds USB connectivity and high temperature re-chargeability for the first time in the industry, yet still manages to be significantly smaller than any other system on the market.
Ultraslim sensor probes are permanently mounted along the length of the reflow oven to measure product level temperature. This newly developed probe design allows for a smaller physical size which offers two significant advantages, fast response to changing oven loading, and the elimination of shadowing problems associated with components mounted close to the conveyor rails.
Product speed and position are monitored by way of high accuracy real-time speed monitoring instrumentation, board-in sensors and a new software algorithm, resulting in a "True Profile" for every board processed.
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