Amkor Technology and United Test and Assembly Center have entered into a multi-year cross-licensing agreement under which Amkor will license its MicroLeadFrame patents to UTAC, and UTAC will license its QFN patents to Amkor. The agreement covers the license of intellectual property rights and transfer of associated packaging technologies.
MicroLeadFrame, or MLF, is Amkor's proprietary version of an integrated circuit package with the generic nomenclature of QFN, which stands for "quad, flat-pack, no lead." Amkor's MLF package is a leadframe-based, nearly chip-scale package with an exposed die paddle and leads on the bottom of the package, providing excellent thermal and electrical performance. Since its introduction in the late 1990's Amkor has seen broad adoption of its MLF technology, and over the past five years, Amkor has shipped approximately five billion MLF packages.
Amkor TechnologyUnited Test and Assembly Center Ltd (UTAC)
