Mobile handsets now require numerous functions and high performance, including slim design, compact body, camera, high-resolution and large LCD, high-speed data transmission, and multiple bands. The electronic components being mounted in terminals also need to be more integrated, smaller and lighter, resistant to temperature change, vibration and shock as well as highly reliable. In responding to these demands, Kyocera has developed the Duplexer SD25 series of chip size package (CSP) by taking advantage of its unique simulation technology that mounts minimized SAW element directly on ceramic substrate, seals it and coats it with resin. Optimizing the combination of the SAW element and the substrate enables the Duplexer to be as small as 2.5 x 2.0 x 0.8mm (typical value), making it one of the smallest duplexers in the industry. The product boasts excellent resistance to climate and mechanical impact thanks to its airtight structure, which seals with soldering the surrounding of the element mounted on the substrate.
Kyocera Corporation, www.kyocera.co.jp
