Hynix joins IMEC’s (sub-)32nm CMOS research platform
(Top News, 25 May 2007 )
Hynix Semiconductor Inc. has entered into a strategic partnership with IMEC to perform research and development for the (sub)-32nm memory process generations.
As part of the agreement, Hynix will collaborate within IMEC’s advanced lithography program addressing both immersion and EUV lithography challenges and within IMEC’s non-volatile memory program. The latter program has gained significantly increased momentum in the past year by expanding its floating gate and nitride memory activity lines into advanced material research, including exploration of advanced high-k dielectrics. From June 2007 onwards, a team of researchers of Hynix will reside at IMEC to closely collaborate with IMEC’s researchers in the abovementioned areas. In this way, they will build up fundamental understanding and develop robust solutions for the 32nm and beyond DRAM and Flash memory process generations.
With this agreement, the top five leading memory suppliers including Hynix, Elpida, Micron, Qimonda and Samsung, collaborate within IMEC’s global research platform to scale CMOS to 32nm node and beyond. The platform also unites world leading logic IDMs and foundries, including Intel, NXP, Panasonic, STMicroelectronics, Infineon, Texas Instruments and TSMC. With leading companies of the two semiconductor market segments jointly collaborating in the platform, a unique interaction and cross-fertilization is established which enhances process R&D to the 32nm node and beyond answering the needs of the whole semiconductor market.
