In a move to address the growing demand for thermally efficient power semiconductors in smaller footprints, Vishay Intertechnology has released seven p-channel power MOSFETs in a new PowerPAK ChipFET package that offers advanced thermal performance in a compact 3-mm by 1.8-mm footprint.
Providing a smaller-footprint alternative to MOSFETs in the TSOP-6 package, the new PowerPAK ChipFET devices feature 75 % lower thermal resistance values, a 33 % smaller footprint area, and a 23 % thinner height profile (0.8 mm).
Maximum power dissipation is 3 W, the same as for the much larger SO-8 package.
With their low conduction losses and enhanced thermal efficiency, p channel power MOSFETs in Vishay’s new PowerPAK ChipFET family enable longer battery run times in portable devices, where they will be used to replace load, charger, and battery MOSFET switches in the TSOP-6. Additionally, the p-channel with Schottky diode version can be used as a charger switch in portable devices or in asynchronous dc-to-dc applications, such as those found in hard-disk drives and game consoles, to replace devices in the SO-8. Because these new PowerPAK ChipFET power MOSFETs are available in a broad variety of configurations and voltages, designers can easily replace larger, less thermally efficient power MOSFETs with devices in this innovative package.
Among the seven new devices announced today are single, dual, and single with Schottky diode power MOSFETs, with breakdown voltage ratings of 12 V and 20 V.
Single p-channel power MOSFETs in the PowerPAK ChipFET family are rated for typical thermal resistance values as low as 3 degrees Celsius per Watt (junction-to-case) with maximum on-resistance values as low as 0.021 ohms in a 20-V drain-to-source p-channel single-channel device and 0.064 ohms in a dual-channel device -- an improvement of up to 50 % compared with devices in the TSOP-6.
Complementary copackaged n- and p-channel PowerPAK ChipFET MOSFETs feature on-resistance values of 0.039 ohms for the n-channel component and 0.072 ohms for the p-channel component, a more than 35 % improvement over the lowest-on-resistance complementary devices in the TSOP-6.
All of these new PowerPAK ChipFET devices are pin-compatible with products in the standard ChipFET package.
Vishay Intertechnology
