3M will present two papers on its embedded capacitor materials at IMAPS 2005, the 38th International Symposium on Microelectronics, to be held at the Pennsylvania Convention Center, Philadelphia, Pennsylvania, 25th to 29th September 2005.
The first presentation, "Thin Substrate Flip Chip Assembly - Managing Substrate Warp Through Controlled Thermal Process," will take place on Tuesday, 27th September from 3:15 p.m. to 4:55 p.m. local time. Shichun Qu, product development specialist, 3M Electronics Markets Materials Division, will present information on 3M multilayer IC substrate technologies, substrate warping challenges and managing warp through control of the thermal process.
A second presentation, "Decoupling of High-Speed Digital Electronics with Embedded Capacitance," will take place Wednesday, 28th September 2005 from 9:45 a.m. to 11:25 a.m. Joel S. Peiffer, applications engineering specialist, 3M Electronic Solutions Division, will present information on a 3M laminate material that allows designers and manufacturers of high-speed, digital-printed circuit boards to achieve higher speeds while simplifying design trade-offs. When used as a power-ground core in a multilayer printed circuit board, 3M embedded capacitor material effectively becomes a decoupling capacitor inside the board. The material allows designers to eliminate large numbers of decoupling capacitors, increasing useable board area; enables faster signaling; lowers radiated emissions (EMI); and saves engineering time associated with power distribution design and board layout. Printed circuit board fabricators can use the material in military, automated test equipment, computer and telecommunications applications.
DisplaySearch, encourages attendees to sign up now for its October 3 webinar covering DisplaySearch's latest outlook for the flat panel display, TV, desktop monitor, notebook PC, glass substrate and other markets.
The first quarterly DisplaySearch webinar will be led by DisplaySearch President and CEO Ross Young. It will cover the following topics plus leave one hour for question and answers:-
-- US TV sell-through results by technology. The impact of the recent TV price cuts on TV demand and share by technology will be provided, indicating which TV technologies gained and lost share in September and for all of the third quarter.
-- A preview of third quarter financial performance throughout the flat panel supply chain, covering panel suppliers, component suppliers and equipment suppliers. It will indicate which companies and markets exceeded expectations and which fell below expectations.
-- The latest TFT LCD supply/demand and fab utilization results and forecasts. Numerous scenarios will also be presented to determine the 2006 and 2007 supply/demand outlook, taking into account optimistic demand and size mix scenarios. The latest capital spending outlook and equipment market forecast will also be included.
-- Updated panel price and cost forecasts, revealing what type of margins are likely for panel suppliers.
-- Preliminary third quarter results and the latest outlook for fourth quarter and beyond for these important applications and markets: Notebook PCs, LCD monitors, LCD TVs, PDP TVs, RPTVs, Large-area TFT LCDs, Small/Medium TFT LCDs, Total flat panel market.
Participants will walk away with an electronic copy of the presentation, including thousands of dollars worth of critical DisplaySearch data as well as answers to their most pressing questions.
The web-based presentation will begin at 1300 hours ET, followed by a one-hour interactive Q&A session, using the WebEx collaborative web meeting application.
