M-Systems and Toshiba Corporation have said that the companies will offer DiskOnChip (DOC) H3, a new generation of on-board, high density embedded flash drives based on DiskOnChip architecture, for mobile handsets and consumer electronics devices. DOC H3 will allow device designers to easily integrate cost-effective, high-density, on-board storage utilizing Toshiba's latest multi-level cell (MLC) NAND flash, and M-Systems' built-in TrueFFS flash management software in firmware.
DOC H3 utilizes 70nm generation MLC NAND flash. By changing the product configuration from a monolithic design to a multi-chip design, Toshiba and M-Systems gain access to the latest advances in NAND flash technology and shorten DOC development time.
Designed with an improved architecture that virtually eliminates the need for integration via software solutions, DOC H3 manages its NAND flash media from within its controller integrated circuit (IC), allowing customers to reduce product development cycles.
"We are very proud to work closely with Toshiba, the world leader of MLC NAND flash," said Dov Moran, president and CEO of M-Systems. "By embedding our TrueFFS flash management technology into the DOC H3 itself, it becomes extremely easy to integrate this reliable and cost-effective EFD into next generation designs."
"Toshiba and M-Systems' many years of partnership and commitment to DiskOnChip architecture have now yielded a new generation NAND flash-based storage solution, the DOC H3. Our focus is to continue delivering the most technologically advanced, cost-effective NAND flash based solutions in order to satisfy the expanding market needs for high density flash memory," said Kiyoshi Kobayashi, Technology Executive, Flash Memory, Toshiba Corporation Semiconductor Company. "Enabling both code and data storage in a single package, DOC H3 is the efficient way for system designers to tap into our leading flash memory technology in an on-board storage form."
Availability
DOC H3 will be made available in a variety of densities ranging from 2-gigabit (256-megabyte) to 16-gigabit (2-gigabyte). First engineering samples of DOC H3 are expected to be available in the second quarter of 2006, with mass production slated for the third quarter of 2006.
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