Free Print Subscription Printer-friendly version Email to a Friend

Si2’s Low Power Coalition Issues Request for Technology

(Interviews, 15 Jan 2007 )

Silicon Integration Initiative (Si2) has announced that the Low Power Coalition (LPC) has issued a Request for Technology (RFT) seeking additional enabling technologies building upon and enhancing the Common Power Format (CPF). CPF was recently approved as a Si2 specification and will be released industry-wide after a patent exclusionary period ending on March 4, 2007.

“This RFT, the technology donations expected, and the release of the CPF specifications are all strong indications of the viability of CPF as an important low-power specification,“ says Steve Schulz, president and CEO of Si2. “As mobile applications become increasingly important to the semiconductor industry, it is critical that we move to common standards for defining low-power intent in the design flow.”


Click here for more information

 
Free Print Subscription Printer-friendly version Email to a Friend
Article Rating 
Average Rate: No rating yet
 
Poor Quite Good Good Very Good Excellent
 
 
Related Content 
 
 
WEBCASTS
 
KNOWLEDGE CENTER
Panasonic Key Devices Guide 2008:
 
Fairchild Semiconductor :
 
 
Highest Rated  
 
 
 
ADVERTISEMENT
Press Release 
 
TECHNOLOGY NEWS
 
RESOURCE CENTER


 
 
PRODUCT NEWS
 
FEATURED SPONSORS


 
 
 
DESIGN CENTERS
 
ADVERTISEMENT
     
Reference Designs 
   
     
 
 
 


RSS
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   

POLL
What type of environmental regulation do you think will be most beneficial for the tech industry?
Proper recycling and disposal
Push for power efficiency and energy conservation
Chemical/lead regulation
View results

Outlook and Trends 2008
 
 
 


 

Reed Electronics Group | Reed Business Information Asia |
EDN India | EDN Taiwan | EDN Korea | EDN Japan | EDN China | EDN | EDN Europe
ECN Asia | ECN Taiwan | ECN Korea | ECN China | EB Asia | WDDA | WDDA Taiwan | WDDA China

 
ABOUT EDN Asia | FREE SUBSCRIPTION | CONTACT US
   
© 2009 Reed Business Information, a division of Reed Elsevier Inc.
All rights reserved. Use of this web site is subject to its Terms and Conditions of Use. View our Privacy Policy.