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Teradyne Demonstrates Advanced In-Circuit Test and Automated X-Ray Inspection Systems at NEPCON China

(Interviews, 23 Apr 2007 )

Teradyne Inc., the industry's leading manufacturer of in-circuit PCB test systems and maker of automated x-ray inspection equipment, will be having new equipment demonstrations at NEPCON China in Shanghai starting April 24, 2007. Equipment demonstrations include Teradyne's new UltraPin II 121 analog and digital pin tester cards for TestStation, new Debug Pro software that improves time-to-market through more efficient development, and the XStation MX 3D X-Ray inspection system based on ClearVue technology.

UltraPin II 121 Analog and Digital Pin Cards
Teradyne's new non-multiplexed analog and digital UltraPin II 121 pin cards are designed to extend TestStation's scalability from cost effective MDA (analog only) applications to the highest-performing digital in-circuit test (ICT) available. Their unique functionality enables unrestricted pin assignments for both analog and digital test applications and gives users greater flexibility when programming driver/sensor logic levels, sense thresholds, slew rates and backdrive limits. The UltraPin II 121 pin boards lower the entry price point of pure-pin test configurations with ultra-low voltage and SafeTest capabilities by more than 30 percent.

Debug Pro Test Programming and Debug Software
TestStation users will benefit from Debug Pro, featuring a more intuitive graphical user interface and providing users with more comprehensive tools, simplified commands and operational displays for faster, easier debugging and qualifying in-circuit test programs.

XStation MX Automated X-Ray Inspection System
Using ClearVue technology, a patented off-center Tomosynthesis 3D image capture technique, XStation MX delivers the industry's highest resolution images to more reliably detect and diagnose PCB defects. XStation MX uses a stationary X-Ray source and detector and, unlike conventional 3D X-Ray inspection systems, does not require complex or rotating mechanical parts. Its new capabilities can significantly lower false call rates, reduce programming times, increase reliability, and improve repeatability.

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