Clear Shape Selected By STMicroelectronics for Variability-Aware DFM for 65nm and Below
(Interviews, 01 Jun 2007 )
Clear Shape Technologies Inc. has announced that STMicroelectronics has selected its Variability Platform products InShape and OutPerform for 65nm and below technology nodes, following a year long extensive evaluation.
ST's comprehensive evaluation had 3 major criteria: 1) accuracy to silicon results and run-time at full chip level; 2) OPC-tool independence; and, 3) comprehensive electrical variability analysis for interconnect and devices.
Clear Shape's model-based design manufacturability checking tool InShape completed full-chip analysis in hours. The electrical variability analysis tool OutPerform predicted electrical characteristics very close to actual silicon results.
"Our requirements for DFM solutions are extremely stringent, since we design high-performance, high volume products for many applications such as mobile communications, computer peripherals and consumer electronics," said Philippe Magarshack, Front-End Technologies and Manufacturing Group Vice President and General Manager of Central CAD & Design Automation at STMicroelectronics. "Clear Shape demonstrated excellent silicon-accurate results and performance. Their solutions will enable our IP and library developers to eliminate systematic variability from their designs thanks to silicon accurate lithography and OPC modeling."
"It is an honor to work with a technology leader like STMicroelectronics," said Atul Sharan, president and CEO, Clear Shape Technologies. "Their engineers are committed to working with us on ensuring that our DFM roadmap is able to meet their needs now and for future process nodes."
