Microchip Technology Selects Teradyne as Microcontroller Test Supplier
(Interviews, 10 Jul 2007 )
Teradyne Inc. has announced that Microchip Technology Inc. has signed an agreement to continue using Teradyne J750 family and FLEX test platform systems for testing its portfolio of microcontroller products, including their high-performance dsPIC digital signal controller (DSC) product line. The selection has driven a volume purchase agreement extending through 2009.
"The J750 and FLEX test platforms help us release new products quickly and meet our high-volume cost reduction goals," said Mathew Bunker, Microchip's Vice President of PACRIM Manufacturing. "The IG-XL software environment allows our engineers to focus on releasing new microcontrollers. We look forward to taking advantage of the increased performance promised by Teradyne with the new J750Ex instruments."
"The J750 and FLEX test platforms are well suited for testing Microchip's advanced microcontroller peripherals, such as Ethernet, USB, and high-resolution ADCs and DACs, each of which are appearing increasingly often on Microchip's PIC18 and PIC24 microcontrollers and dsPIC DSC products," said Joe Thomsen, Director of Product Development for Microchip's Advanced Microcontroller Architecture Division.
Microcontrollers span a wide range of applications from toys and appliances to automobile electronics. Testing microcontrollers can only be done cost effectively when testing multiple devices in parallel at high parallel efficiency. The J750Ex expands the J750 platform capability to meet new critical test requirements for digital, DFT, embedded memory, analog and power-supply testing, and offers greater than 98 percent parallel test efficiency. The J750 software, IG-XL, was designed from the ground up for high-throughput, multisite testing, and has become the standard software system for all Teradyne semiconductor test systems.
