EV Group and Brewer Science's new ultrathin-wafer bonding technology key to advanced packaging applications
(Technology News, 10 Dec 2007 )
A key industry milestone has been reached today surrounding the handling and processing of ultrathin wafers. In their ongoing joint development work, EV Group (EVG), a leading supplier of wafer-bonding and lithography equipment for the advanced semiconductor and packaging, MEMS, silicon-on-insulator (SOI) and emerging nanotechnology markets, and Brewer Science, Inc., the pioneer of industry-enabling technologies solutions for the semiconductor/microelectronics chemicals and equipment marketplace, have demonstrated temporary wafer bonding capabilities for a wide range of backside processes, including through silicon vias (TSVs) and backside metallization.
The solution resulted from a multi-year partnership formed to address growing industry demand for flexible, yet reliable, processes and equipment that can accommodate the challenges associated with increasingly thin and fragile product wafers -- particularly for advanced 3D and wafer-level packaging approaches. Both EVG and Brewer Science are committed to speeding commercialization of TSVs for 3D chip stacking, as evidenced by their membership in the EMC-3D Consortium, of which EVG is also a co-founder.
