IBM and Toshiba Corp. have entered into a joint development agreement on 32nm bulk complementary metal oxide semiconductor (CMOS) process technology. Through this collaboration IBM and Toshiba plan to accelerate development of next-generation technology to achieve high-performance, energy-efficient chips at the 32nm process level.
Since December 2005, IBM and Toshiba have collaborated on fundamental advanced research related to semiconductor process technologies at the 32nm technology generation and beyond at the research facilities in Yorktown and Albany, New York. Building on the success of this ongoing research collaboration, the two companies have agreed to extend the scope of the joint development work to now include 32nm bulk CMOS process technology.
Under the new agreement, Toshiba joins a six company IBM Alliance for 32nm bulk CMOS process technology development based in East Fishkill, New York.
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