ERNI Electronics is now offering a complete development kit for analysing the signal integrity of the MicroSpeed connector family, which features a range of high-speed connectors with high contact density in a 1mm pitch for board-to-board applications that are particularly suited to the bandwidth requirements of modern mezzanine applications.
The early validation of the connector's signal integrity is playing an increasingly important role in enabling high performance applications in the Gbps range. And this is complemented by the corresponding Spice models for early system simulation, which are now available for designs using MicroSpeed connectors. This advance performance data means that customers can now use the new evaluation kit to determine whether or not the connector system is suitable for their application.
The kit consists of two PCBs, each with four MicroSpeed connectors and a guide and detaching aids. At the rear of the boards are 30 high-end miniature coaxial connectors that are connected with the defined signal contacts of the MicroSpeed connector. Also included are two connecting cables, a CD with the Spice models and a description of the circuits packed for delivery in a robust plastic box.
