austriamicrosystems Expands CMOS and RF MPW Service
(Product News, 15 Nov 2007 )
Austriamicrosystems has expanded its speedy ASIC prototyping service, known as Multi-Project Wafer (MPW) or shuttle run, with an extensive schedule for 2008. The service which combines several designs from different customers onto one wafer allows sharing the costs for wafer and masks among a number of different shuttle participants. The MPW service includes the whole range of processes in 0.35µm geometry which are based on the 0.35µm CMOS process transferred from TSMC (Taiwan Semiconductor Manufacturing Company). The CMOS compatible 0.35µm Silicon-Germanium BiCMOS technology enables RF circuit designs with an operating frequency of up to 10 GHz combined with high-density digital parts on one single ASIC. The 0.35µm High-Voltage CMOS process family with a 20V CMOS option, ideally suited for power management products and display drivers, and a 50V CMOS process, optimised for automotive and industrial applications, serve customers’ demand for high-voltage applications and products.
