Qualcomm Incorporated has introduced three new 45nm single-chip solutions designed to enable mass-market smartphones with a range of high-performance capabilities. The QSC7230 for HSPA+ devices, QSC7830 for CDMA2000 1xEV-DO Rev. B devices, and multi-mode QSC7630 for both HSPA+ and EV-DO Rev. B, feature what’s said to be the highest levels of integration in the wireless industry today, and deliver support for third-party operating systems. These three single-chip solutions are the fifth generation of dual-core solutions from Qualcomm, comprising the next evolution of the Company's MSM7xxx-series dual-core chipsets.
The products offer the most advanced cellular modem technologies, a multi-band RF transceiver supporting all frequency bands worldwide, an ARM11 application processor running up to 600 MHz, Bluetooth 2.1 EDR, FM radio and GPS -- all in a single 12x12 package. Additionally, the three chipsets feature new power-saving innovations to deliver more than 80 hours of music playback, a full day of talk time, and more than a month of standby time.
Qualcomm Incorporated, www.qualcomm.com
