Dialog Semiconductor PLC (has announced that AsusTek, a leading provider of 3C total solutions, will adopt Dialog's latest generation ASSP (application specific standard product) system power, user interface, audio and RF devices in their next wave of smartphone products. The expanded relationship between the European-based mixed signal chip provider and the major IT industry player is the result of increasing co-operation between the two companies during the past two years.
The ASSP audio and power management IC will provide Asus smartphone users with faster wireless connectivity, richer multimedia capability and a more compelling user experience.
Optimized system power management has become increasingly critical for the next generation wireless handheld products which are becoming smaller, lighter and thinner. Enhanced smart power management across all operating modes allows deployment of smaller battery packs and reduced board-level power dissipation. This in turn allows higher integration and component density enabling the timely launch of more reliable products in exciting new form factors.
Dialog Semiconductor
