EV Group (EVG), a leading supplier of wafer-bonding and lithography equipment for the advanced semiconductor and packaging, MEMS, silicon-on-insulator (SOI) and emerging nanotechnology markets, has received an order from the Indian Institute of Technology (IIT), Bombay, for two of EVG's MEMS-focused systems. IIT Bombay purchased the EVG620TB bond and mask aligner and EVG501 wafer bonder for a new Indian government-supported automotive MEMS R&D project being pursued in close cooperation with the Indian Institute of Science, Bangalore, which previously purchased the same EVG equipment. The new EVG systems are slated for installation this month in IIT Bombay's Mumbai facility.
According to estimates by Phoenix-based market research and consulting firm Semiconductor Partners, the MEMS market will reach US$10 billion by 2011. Automotive MEMS represent the second largest segment within the overall MEMS market, after IT peripherals, with the number of MEMS devices per vehicle expected to increase by approximately one-third over the same period.
The EVG620TB performs precise wafer/substrate alignment with 1 micron alignment accuracy for wafer-bonding applications. It features a high-resolution, bottom-side split-field microscope and special capabilities to support MEMS processing requirements, including bond alignment for double and triple stacks, and universal align/bond chucks to transfer aligned wafers to wafer-bonding systems in the EVG500 family.
The EVG501 performs anodic, thermo-compression, fusion bonding or low-temperature plasma bonding via a single, universal bond chamber in which the top and bottom of the wafer are heated independently to compensate for different coefficients of thermal expansion. The system can support all MEMS wafer sizes and materials up to 150mm, with full support for fragile or bowed wafers, and is designed for ease of transfer from R&D to volume production.
IIT BombayEV Group
