Datacon, a leading supplier of advanced packaging equipment, and Ablestik, a leading supplier of adhesives and specialty materials for semiconductor packaging and microassembly applications, have joined forces to provide joint technological development and shared product evaluations and demonstrations to the marketplace. The aim of this partnership is to strengthen technological leadership, especially in processes such as thin die and/or stacked die handling as well as other advanced epoxy processes, and to advise customers of both companies on the best solutions for their production needs.
