At an event in Tokyo, Gilles Delfassy, Texas Instruments Inc.'s senior VP and general manager of its wireless terminals business unit, disclosed that TI 3G technology is included in all new models of NTT DoCoMo’s FOMA 901i and 700i series.
The move adds momentum to the Dallas-based cellular player's already strong 3G push.
"With more than 50 percent share of the 3G semiconductor marketplace with both its market-leading 3G modems and OMAPTM processors, TI's 3G technology is currently used in over 45 different handset models shipping worldwide today from six of the top seven 3G manufacturers," Delfassy said at the event.
"The rapid acceleration of 3G is due largely to early adoption by the technology savvy Japanese market. Clearly Japan continues to lead the world in 3G innovation, and TI is proud to be a part of this growth," he added.
TI's OMAP family of applications processors have been used by 3G handsets manufacturers for three consecutive years for NTT DoCoMo's FOMA 3G series of mobile phones, which now service more than 10 million subscribers in the Japanese 3G market.
"We are pleased to continue our long-standing, collaborative relationship with 3G handset manufacturers to deliver the ultimate 3G mobile phones to Japanese consumers, while driving widespread adoption of 3G beyond Japan," Delfassy said.
Delfassy also referred to TI´s joint agreement with NTT DoCoMo to develop a cost-competitive, multi-mode UMTS (WCDMA/GSM/GPRS/EDGE) chipset to serve the 3G handset marketplace.
"Both companies aim to foster the earliest possible widespread use of 3G handsets by creating winning solutions for the 3G marketplace," he remarked. "TI, collaborating with NTT DoCoMo, will provide an integrated UMTS digital baseband and applications processor based on TI´s OMAPTM 2 architecture and NTT DoCoMo´s WCDMA technology for NTT DoCoMo handsets and other 3G handsets worldwide."
