Tyco Electronics Corporation’s Z-PACK Slim UHD (Ultra High Density) connector series is a new, cost-effective connector interface that is designed to support the increasing demands for higher signal density in small system slot pitches. The Z-PACK Slim UHD product is a flexible and upgradeable connector system, fitting in 15 mm (0.6 inch) system slot pitch applications and above. This new connector has an extremely high contact density (55 pins / cm2 or 355 pins / inch2) combined with excellent signal performance.
Flexibility is achieved by giving the board designer the ability to implement pin assignments (single ended or differential, in different configurations) in such a way that they fulfill the application signal requirements for today or at a later point in time during the application’s project life. By exchanging the daughtercards, two different receptacle connector performance versions are created, enabling the application to be upgradeable and, at the same time, cost-effective. The Common Speed (CS) version can be used for signal speeds up to about 3.5 Gbps. The High Speed (HS) version is capable of operating at 20+ Gbps. Both receptacle versions have identical envelope dimensions and mate with a uniform header connector.
The low profile and high density features allow designers to reduce the board spacing between adjacent daughter cards in a rack, making room for more cards or reducing the size of the application. The Z-PACK Slim UHD connector can also assist in thermal management within the system by creating less obstruction to cooling airflow.
The over-molded signal contacts in the receptacle, in combination with the plastic ribs embedded in the header design, result in a reliable and highly protected interconnect solution.
The product portfolio consists of a right-angle receptacle, vertical header and guiding modules. The Z-PACK Slim UHD product family will be completed with the addition of a right-angle header (coplanar) and power modules.
Tyco Electronics
