Qualcomm and IMEC collaborate on 3D Integration Research
(Top News, 25 Jul 2008 )
IMEC and Qualcomm Incorporated have announced that Qualcomm is the first fabless integrated circuit company to participate in IMEC's industrial affiliation program (IIAP) on three-dimensional (3D) integration. Qualcomm and IMEC researchers in the program will collaborate to understand and develop solutions for the use of 3D technologies in future wireless products.
IMEC's 3D integration program explores three dimensional technology and design for application in various domains. The technology research program focuses on 3D wafer-level packaging and 3D stacked-ICs to find innovative solutions for the cost-effective use of 3D interconnects at different levels of the wiring hierarchy. The 3D system-on-chip design research program provides insights to its benefits, costs, challenges and solutions. The program will also include the development and demonstration of the IP and tools necessary for designing in three dimensions.
"Three-dimensional design will allow Qualcomm to offer superior features and performance in our products," said Jim Clifford, senior vice president and general manager, Qualcomm CDMA Technologies. "We are collaborating with IMEC because their research and technology expertise will help us to accelerate the implementation of 3D design in our products."
Other partners in IMEC's 3D integration program are Amkor, Infineon, Intel, Micron, NEC, NXP, Panasonic, Qimonda, Samsung, ST Microelectronics, Texas Instruments and TSMC.
