Power Integrations has announced a new, ultra-low-profile package for its popular TOPSwitch-HX family of AC-DC power conversion ICs. This small new package combined with the best-in-class efficiency and high operating frequency of TOPSwitch-HX enables remarkably slim, compact, and lightweight power supplies from 20 to 100 watts. Applications include adapters for notebook computers, as well as power supplies for LCD monitors and flat-panel TVs, in which slim form factor and high efficiency have become critical design criteria.
The new "L" shaped lead-bend allows the company's innovative eSIP package to lie flat against the printed circuit board with the heatsink pad facing upwards. The device stands just 2 millimeters above the board giving plenty of space for a heatsink and enabling extremely slender power supply designs.
The elegance of adapter designs enabled by the new package is demonstrated by a new reference design (DER-196) for a 65 W notebook adapter only slightly larger than a standard deck of playing cards. The design, which complies with the upcoming ENERGY STAR(R) 2.0 specifications for external power supplies, utilizes a TOP261 chip in the new eSIP-L package. The highly efficient IC combines a 700 V switching power MOSFET with controller and supervisory functions into a single monolithic IC, reducing the need for bulky heatsinks required in designs using traditional TO-220 packaged MOSFETs and discrete controllers, and eliminating the need to encase the electronics with thermally-conductive potting compound. The package's 90-degree pin deflection enables the PCB, chip and heatsink to lie parallel to each other, while the high switching frequency of TOPSwitch-HX eliminates the need for an expensive planar type transformer. This, together with Power Integrations' proprietary transformer design, greatly reduces both the cost and size of the notebook adapter.
Power Integrations
