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IC Packaging Expert Appointed CTO of Alchimer

(Business News, 23 Sep 2008 )

Alchimer S.A., the thin films for TSV metallisation company, has appointed Dr. Claudio Truzzi as Chief Technology Officer (CTO). Dr. Truzzi's role at Alchimer will be to help unfold the company's technology potential and strengthen its rich IP portfolio.

Alchimer, a spin-out from France's CEA (Commissariat á l'Energie Atomique), has developed materials and process IP for creating thin coatings on the inside of high-aspect ratio through-silicon vias (TSVs). Since conventional techniques have reached their limit at TSV aspect ratios of 3:1, Alchimer's technology, which enables TSVs with aggressive aspect ratios of 10:1 and greater, is well-placed to drive the adoption of advanced 3D IC packaging.

Dr. Truzzi's distinguished career spans every facet of the semiconductor industry, including R&D, Engineering, Manufacturing and Product Development. He has over 20 years' experience in the field of microelectronics and has previously held executive level positions as CEO of IC packaging consultancy Convergix, and at CS2 where he was CTO and VP. Most recently, Dr. Truzzi has worked as an independent consultant to several large players in the EMS, semiconductor manufacturing equipment and wafer-level process companies. His academic career includes Assistant Professor positions at various Universities and numerous publications. Dr. Truzzi holds an MSc from the University of Bologna and a PhD from the University of Turin.

Alchimer S.A

 
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