NXP Semiconductors, the independent company founded by Philips, has announced a new range of MEGA Schottky rectifiers housed in its new FlatPower packages, SOD123W and SOD128. As a result of the packages' clip bond technology, the new MEGA devices deliver high-power capability comparable to standard SMA packages: Boosting the best-in-class low forward voltage-drop, the new types allow a high peak current of more than 50 A and achieve power dissipation Ptot up to 1 W.
At the same time, the height of both packages is reduced by 50 percent compared to SMA packages, thus enabling much smaller designs. The SOD123W supports this trend with a body size of 2.6 mm x 1.7 mm x 1 mm; the dimensions of the SOD128 are 3.8 mm x 2.5 mm x 1 mm. Both packages are footprint-compatible to SMA and SMB packages, providing an ideal solution for a 1:1 replacement.
The MEGA Schottky rectifiers are designed for a broad range of low-voltage and mobile applications including power management circuits, DC/DC converters, step down and synchronous converters, and free-wheeling diodes for inductive load in motors and relays. Qualified to the rigorous AEC-Q101 standard, the new FlatPower diodes can be used for automotive and industrial applications.
The SOD123W and SOD128 MEGA Schottkys meet the following environmental protection targets. The plastic is free of halogens and antimony oxides and complies with non-flammability classification UL 94V-0 and RoHS standards
NXP Semiconductors
