ITT Interconnect Solutions has developed a micro miniature connector capable of providing 100 signals in a lightweight, compact package. The MDM PCB connector features contact pitch spacing of 0.050", providing maximum signal density for applications where board space is at a premium.
"The MDM PCB connector meets specific customer requirements for a 100-position robust, compact connector design," said Keith Teichmann, director of marketing for ITT Interconnect Solutions. "We have also integrated EMI shielding via a special back molding process, saving further space and weight on the PC board."
Due to the high signal density and robust, lightweight package design, the 100-position MDM PCB connectors are ideal for use in avionics applications, oil field exploration, electronic instrument packages and satellite systems.
Housed in an aluminum shell with W/LCP dielectric, the connector features a twist pin contact system along with crimped gold plated contacts, ensuring high signal integrity. Multiple plating options and jack post hardware are also available.
ITT Interconnect Solutions, www.ittcannon.com.
