Lattice Semiconductor is now mass producing its industrial temperature-qualified non-volatile LatticeXP2 FPGAs have been released to volume production. Based on Lattice's 90nm hybrid flexiFLASH technology, the XP2 family's volume production availability in industrial temperature-qualified devices enables realization of design requirements in a multitude of industrial applications such as medical imaging, robotics, human machine interface (HMI) systems, motor control and industrial displays.
The LatticeXP2 family has been fully qualified and characterized to meet industrial temperature requirements, and is available for the full range of devices, from the smallest LatticeXP2-5 through the largest LatticeXP2-40 (5K and 40K LUTS, respectively). Depending on the device, low cost BGA and QFP packages that meet industrial temperature requirements are also available.
The non-volatile LatticeXP2 FPGA family is a compelling solution for designers who value single chip integration, impressive processing power in the smallest footprint, source synchronous interfaces, design security and low power consumption. The XP2's unique benefits include low cost, small form factor Chip Scale 132 BGA packaging, and increased functionality such as pre-engineered source-synchronous I/O that supports 7:1 LVDS, DDR2 and high-speed ADCs/DACs.
Unlike traditional SRAM-based FPGAs, the LatticeXP2 device does not require an external boot memory for FPGA configuration, which enables a single-chip solution with the associated benefits of reduced board area and simplified system manufacture. The absence of an external boot device also eliminates the need for an external bit-stream at boot up and the possibility of bit-stream snooping, a major security concern with SRAM FPGAs. Additional security features prohibit bit-stream readback from the SRAM and Flash sections of the devices.
Lattice Semiconductor
