EPCOS has launched an improved and particularly rugged version of SMT power inductors for automotive electronics. The design, which features a baseplate with injection-molded termination clips, increases the mechanical stability and improves the temperature distribution during the solder process. Lands with a nickel barrier-layer coating satisfy the tougher demands for use in automotive electronics.
The new series currently comprises six types: four shielded (P series) and two unshielded (M series). Depending on the type, their dimensions range between 7.3x7.3x4.5mm and 12.5x12.5x8.5mm. The components are available with inductances from 0.82µH to 1mH, and have a current handling capability of up to 15A. Their series resistance is only 5.5mΩ at low inductances. All types are designed for operating temperatures of up to 150°C and pass a vibration test of 10g for 72h. They also satisfy the requirements of the handling-drop test to ISO 16750-3. The new SMT power inductors are qualified to the AEC-Q200 standard and satisfy the solder profile to JEDEC-020-C.
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