ON Semiconductor has introduced two electrostatic discharge (ESD) protection devices housed in its new, ultra-small 0201 Dual Silicon No-Lead (DSN-2) package. The DSN style package, which measures a mere 0.6x0.3x0.3mm, enables 100 percent utilization of the package area for active silicon, offering a significant performance-per-board-area advantage compared with products in plastic molded packages.
The company’s ESD11N5.0ST5G and ESD11B5.0ST5G are expansions of its off-chip ESD protection portfolio. They are suitable for data lines in portable applications where board space is often extremely limited, such as cell phones, MP3 players, PDAs, and digital cameras.
The ESD11N and ESD11B boast best in class clamping voltage. The ESD11N is a 0.6pF device that maintains less than 0.5dB insertion loss up to 3GHz and excellent capacitance linearity over voltage and frequency, making it suitable for protecting high frequency antenna lines with minimal effects. The ESD11B is a 15 pF device that expands ON Semiconductor low clamping ESD protection technology into the new 0201 DSN-2 package to provide a protection option for general purpose and low speed data lines that have tight board designs with limited room.
On Semiconductor
On Semiconductor's circuit protection devices portfolio
