NEC Electronics Corp. and Toshiba Corp. have extended their technology development agreements with IBM Corp. to participate in the development of a 28nm, high-k metal gate (HKMG) low-power chip technology geared for consumer products.
NEC Electronics and Toshiba join the IBM technology alliance to develop a 28nm bulk complementary metal oxide semiconductor (CMOS) process technology. The alliance, based at IBM's facility in East Fishkill, New York, now includes Chartered Semiconductor Manufacturing Ltd, GLOBALFOUNDRIES, Infineon Technologies, NEC Electronics, Samsung Electronics Co. Ltd, STMicroelectronics, and Toshiba.
The low-power 28nm technology can contribute to faster processing speed and longer battery life in next-generation mobile communication devices and other consumer electronics applications.
The 28nm alliance builds on the success of earlier joint development work in 32nm HKMG technology. Clients can transition to 28nm technology without the need for a major redesign, with lower risk, reduced cost and faster time-to-market. Internal test results have shown the power-efficient advantages of HKMG and device performance that meets or exceeds competitive targets.
Toshiba joined the IBM bulk semiconductor process technology development alliance in December 2007 and NEC Electronics joined in September 2008.
IBM's semiconductor products and services
NEC Electronics
Toshiba
IBM
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