Fujitsu Microelectronics Ltd and Taiwan Semiconductor Manufacturing Co. Ltd (TSMC) will be collaborating on 28nm process technology targeted for foundry production of Fujitsu Microelectronics' 28nm logic ICs and to jointly develop an enhanced 28nm high-performance process technology by utilizing TSMC's advanced technology platform. Previously, both companies announced that Fujitsu Microelectronics will collaborate with TSMC on 40nm production. This will extend Fujitsu Microelectronics' 40nm collaboration with TSMC and covers joint development of an optimized 28nm high-performance process technology.
This collaborative effort combines Fujitsu Microelectronics' expertise and strength in advanced high-speed process and low-power design technologies with TSMC's expertise and strength in power-efficient high- performance logic/SoC process and leading-edge technology platform that is part of the Open Innovation Platform from TSMC. Extending the collaboration to 28nm will provide the opportunity for both companies to capitalize on a competitive and high-performance 28nm technology based on TSMC's 28nm technology portfolio that includes high-performance and low-power applications.
The two companies are also discussing possibilities for collaborating on advanced packaging that could include joint developments that combine Fujitsu Microelectronics' strengths in high-performance lead-free and ultra-high-pin count packaging technologies, with TSMC's strength in chip-package integration and advanced Cu/ELK interconnect.
Fujitsu Microelectronics
TSMC
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