Bookmark and Share Printer-friendly version Email to a Friend

Black Sand Technologies Develops World’s First 3G CMOS RF Power Amplifier

(Top News, 07 Sep 2009 )

Black Sand Technologies Inc., a fabless semiconductor company specializing in advanced power amplifier technology for wireless applications, has developed the world’s first 3G CMOS RF power amplifier (PA). Black Sand’s proprietary CMOS PA architecture offers a breakthrough in combined performance, cost, battery life, and reliability for mobile devices such as mobile phones and datacards. The company also announced today that it has received US$10 million in its second round of funding, led by Northbridge Venture Partners and joined by Austin Ventures, bringing the total investment in the company to $18.2 million. Black Sand will use the funding to bring its power amplifiers into mass production and accelerate development of additional products.

Black Sand’s RF PA products are targeted at mobile phones and other 3G wireless devices, such as datacards and netbooks. Mobile phones and wireless products today use power amplifiers based on Gallium Arsenide (GaAs) semiconductor technology. Replacing GaAs with CMOS silicon technology improves manufacturing yield, performance, cost, battery life, and call quality.

Over time CMOS has replaced GaAs technology in many other applications from audio chips to DVD decoders. However, CMOS does not lend itself easily to use in power amplifiers, so a revolutionary architecture was required. "By leveraging our breakthrough PA architecture, Black Sand, as the first company to deliver 3G PAs in CMOS, is ready to capitalize on the historic shift from GaAs to CMOS, and benefit from the explosion in demand for new 3G devices appearing on the market today,” said John Diehl, CEO of Black Sand Technologies.

“The RF front end of mobile phones is continuing to grow in complexity and with the development of linear, 3G CMOS PA technology, enabling advances such as integrated digital control circuits, Black Sand is in a unique position to profit from this technological shift as the market moves from 2G to 3G,” added Brian Modoff, Senior Wireless Equipment Analyst at Deutsche Bank.

“We were impressed to see that Black Sand delivered working samples of their new PA architecture much sooner than expected,” said Basil Horangic, Partner at Northbridge Venture Partners. “This is a very competitive market and Black Sand’s linear PA architecture puts them out in front. Their unique offering will provide the basis for a broad portfolio of products from 2G to 4G.”

Black Sand

 
Printer-friendly version Email to a Friend
Article Rating 
Average Rate: No rating yet
 
Poor Quite Good Good Very Good Excellent
 
 
Related Content 
 
 
ADVERTISEMENT
 
 
ON-DEMAND WEBCASTS

 
Highest Rated  
 
 
 
 
ADVERTISEMENT
 
 


TECHNOLOGY NEWS
 
 
 
PRODUCT NEWS
 
FEATURED SPONSORS
 
 
 
DESIGN CENTERS
 
ADVERTISEMENT
 
     
CURRENT ISSUE
 
COVER STORY:

Analog design in the 21st century: challenges, tools, and IC advances

We are now more than a decade into the 21st century, and on an ever-accelerating fast track to technological innovation in electronics. The transistor and progression into the IC, or microchip, lit the fuse leading to the explosion of innovations in electronics that is now taking place. Since the wi ...
HIGHLIGHTS:
SPECIAL REPORT
DESIGN FEATURES
 
PULSE
 
 
 
 


 


RSS
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   
   

POLL
What type of environmental regulation do you think will be most beneficial for the tech industry?
Proper recycling and disposal
Push for power efficiency and energy conservation
Chemical/lead regulation
View results

 
 
 
 
 
 
Power Technology E-newsletter 
Power.org Releases Power Architecture 32-bit Application Binary Interface Supplement
EDNA, May 11
POL Regulators Designed for Energy-efficient Computing
EDNA, March 11
Fairchild Revolutionizes Power Savings
EDNA, January 11
Lattice Transforms Board Power and Digital Management
EDNA, November 10
 
Analog E-newsletter 
12V Dual-channel Synchronous Buck Converter Features Integrated FETs
EDNA, February 10
Power MOSFETs features reduced top-side thermal impedanc
EDNA, January 10
 

 
KNOWLEDGE CENTER
 
Texas Instruments: DaVinci™ Technology
 
Texas Instruments: Safe Bet Series
 
 
INDUSTRY LINKS
 
Photonics Association (Singapore)
Singapore Industrial Automation Association (SIAA)
Taiwan Semiconductor Industry Association (TSIA)
 
 
 
 
OUR SPONSORS
 







Keithley Instruments
With more than 60 years of measurement expertise, Keithley Instruments has become a world leader in advanced electrical test instruments and systems from DC to RF (radio frequency). Our products solve emerging measurement needs in production testing, process monitoring, product development, and research...
 
 
 
     
 

EDN India | EDN Taiwan | EDN Korea | EDN Japan | EDN China | EDN | EDN Europe

 
ABOUT EDN Asia | | CONTACT US
   
© 2012 EDN Asia All rights reserved.