ON Semiconductor’s ESD11N5.0ST5G and ESD11B5.0ST5G electrostatic discharge (ESD) protection devices are housed in its new, ultra-small 0201 Dual Silicon No-Lead (DSN-2) package. The DSN style package measures a mere 0.6x0.3x 0.3mm and enables 100 percent utilization of the package area for active silicon. The 0.6pF ESD11N utilizes patented integrated ESD technology from ON Semiconductor, which enhances clamping performance while maintaining low capacitance. It maintains less than 0.5dB insertion loss up to 3GHz. The ESD11B is a 15pF device that expands ON Semiconductor’s low clamping ESD protection technology into the new 0201 DSN-2 package to provide a protection option for general purpose and low speed data lines that have tight board designs with limited room. Both devices clamp an input ESD waveform of 8kV per the IEC61000-4-2 contact standard, to less than 10V in a matter of nanoseconds.
ON Semiconductor
