Qualcomm Inc. is working closely with foundry partner Taiwan Semiconductor Manufacturing Co. (TSMC) on 28nm process technology. The advanced process node enables more features to be integrated into smaller chips with a high level of cost efficiency, accelerating the expansion of wireless into new market segments.
Small form factor and low power consumption are important features of Qualcomm's next generation of system-on-a-chip (SoC) solutions, including the Snapdragon chipset platform. The two companies are capitalizing on their long-term relationship as Qualcomm works on migrating directly from the 45nm to the 28nm node.
Qualcomm and TSMC worked closely on 65nm and 45nm technologies. They are continuing their relationship into low-power, low-leakage 28nm designs for high-volume manufacturing. Delivering up to twice the density of previous manufacturing nodes, 28nm technology allows semiconductors that power mobile devices to do far more with less power. Qualcomm and TSMC are working on both high-k metal gate (HKMG) 28HP and silicon oxynitride (SiON) 28LP technologies. Qualcomm expects to tape out its first commercial 28nm products in mid-2010.
TSMC
Qualcomm
RELATED ARTICLES
GLOBALFOUNDRIES, Qualcomm to Collaborate on Leading-edge Technology Development
Digi, Qualcomm to Collaborate on Wireless M2M Designs Incorporating Gobi Technology
MediaTek, Qualcomm Enter into Patent Arrangement
Qualcomm Now Sampling Dual-carrier HSPA+ and Multi-Mode 3G/LTE Chipsets
Qualcomm Brings Gigahertz Processing to Smartphone Chipsets
Qualcomm, Room to Read, Nepal Telecom and S-Fone Establish Computer Labs with 3G Internet Connectivity in Rural Communities
